专著:
文章:
2018:
2017:
Jing Shi, Wenchao Tian, Electric-field induce phase transition and fatigue behaviors of (Bi0.5+x/2Na0.5-x/2) 0.94Ba0.06Ti1-xFexO3 ferroelectric, Journal of the American Ceramic Society, 2017, 100(3): 1080-1090 (SCI: 000397503100029, JCR: Q1, Impact Factor: 2.956, 5-Year Impact Factor: 2.971)
Yongkun Wang, Wenchao Tian, Guangming Zhu, Electro-induced shape memory nanocomposite containing conductive carbon nanotubes, Journal of Nanoscience and Nanotechnology, 2017, 17(6): 3973-3679 (SCI:000402483900004, JCR: Q3, Impact Factor: 1.338, 5-Year Impact Factor: 1.105)
Zhiqiang Chen, Wenchao Tian, Xiaotong Zhang, Analysis of a novel double driving signal line and driving electrodes separated RF MEMS switch, Modern Physics Letters B, 2017, 31(11): 1750113-1-18 (SCI: 000399832300003, JCR: Q4, Impact Factor: 0.731, 5-Year Impact Factor: 0.628)
2016:
Wenchao Tian, Xiangyang Zhang, Zhiqiang Chen, Haoyue Ji, A review of graphene on NEMS, Recent Patents on Nanotechnology, 2016, 10(1): 3-10 (SCI: 000373124800003, JCR: Q3, Impact Factor: 1.475, 5-Year Impact Factor: 1.884)
Yongkun Wang, Wenchao Tian, Guangming Zhu, Jianqiang Xie, Thermomechanical and shape memory properties of SCF/SBS/LLDPE composites, Chinese Journal of Polymer Science, 2016, 34(11):1354-1362 (SCI: 000386709500006, JCR: Q2, Impact Factor: 2.016, 5-Year Impact Factor: 1.582)
Yongkun Wang, Wenchao Tian, Jianqiang Xie, Yan Liu, Thermoelectric responsive shape memory graphene/hydro-epoxy composites for actuators, Micromachines, 2016, 7(8): 145-154 (SCI: 000382467700017, JCR: Q2, Impact Factor: 2.222, 5-Year Impact Factor: 2.236)
Yongkun Wang, Junjie Ye, Wenchao Tian, Shape memory polymer composites of poly (styrene-b-butadiene-b-styrene) copolymer / liner low density polyethylene / Fe3O4 nanoparticles for remote activation, Applied Sciences, 2016, 3: 333-342 (SCI: 000389532800024, JCR: Q3, Impact Factor: 1.689, 5-Year Impact Factor: 1.855)
Yi Tian, Xinbo Huang, Wenchao Tian, Hybrid method for calculation of ion-flow fields of HVDC transmission lines, IEEE Transactions on Dielectrics and Electrical Insulation, 2016, 23(5): 2830-2839 (SCI: 000389215000039, JCR: Q2, Impact Factor: 1.774, 5-Year Impact Factor: 2.048)
Wenchao Tian, Haoyue Ji, Recent research of electromagnetic characteristics in wire bonding, Recent Patents on Mechanical Engineering, 2016, 9(2): 101-111 (EI: 20162402501958)
Wenchao Tian, Qiang Chao, Jing Shi, Reconfigurable antennas based on RF MEMS switches, Recent Patents on Mechanical Engineering, 2016, 9(3): 230-240 (EI: 20163802813099)
Wenchao Tian, Hao Cui, A simplification method of solder joints for thermal analysis in 3D packages, 17th International Conference on Electronic Packaging Technology, ICEPT, 16-19 Aug. 2016, Wuhan, China; Publisher: IEEE, Piscataway, NJ, USA, 812-815 (SCI: 000389835800177, EI: 20164502990900)
Wenchao Tian, Hao Cui, A simplification method of TSV interposer for thermal analysis in 3D packages, 17th International Conference on Electronic Packaging Technology, ICEPT, 16-19 Aug. 2016, Wuhan, China; Publisher: IEEE, Piscataway, NJ, USA, 820-823 (SCI: 000389835800179, EI: 20164502990902)
Wenchao Tian, Wenhua Li, Molecular dynamics study on vibrational properties of graphene nanoribbon resonator, Journal of Computational and Theoretical Nanoscience, 2016, 13(10): 7460-7466
2015:
Wenchao Tian, Zhiqiang Chen, Analysis of bistable inductive micro switch based on surface micro size effect, Applied Surface Science, 2015, 334: 32-39 (SCI: 000351609900007, JCR: Q1, Impact Factor: 4.439, 5-Year Impact Factor: 3.743)
Wenchao Tian, Sanjuan Wei. Current research status of microchannel thermal management technology, Recent Patents on Mechanical Engineering, 2015, 8: 1-12 (EI: 20153401206634)
Wenchao Tian, Qiang Chao, Zhiqiang Chen, Failure mechanisms and reliability analysis of RF MEMS switches, Recent Patents on Mechanical Engineering, 2015, 8: 201-210 (EI: 20155101694062)
Wenchao Tian, Haoyue Ji, Reliability analysis and thermal resistance degradation of high power chip under harsh environment, 16th International Conference on Electronic Packaging Technology, ICEPT, 11-14 Aug. 2015, Changsha, China; Publisher: IEEE, Piscataway, NJ, USA, 1139-1144 (SCI:000380377000251, EI: 20160701931415)
Wenchao Tian, Sanjuan Wei, Reliability analysis of and experiment test on SAC305 solder balls, 16th International Conference on Electronic Packaging Technology, ICEPT, 11-14 Aug. 2015, Changsha, China; Publisher: IEEE, Piscataway, NJ, USA, 1134-1138 (SCI: 000380377000250, EI: 20164502990902)
Wenchao Tian, Zhiqiang Chen, Analysis of a double-phase regulation and an ultra wideband tunable micro electromechanical system resonator, 2015 16th International Conference on Electronic Packaging Technology, ICEPT, 11-14 Aug. 2015, Changsha, China; Publisher: IEEE, Piscataway, NJ, USA, 1149-1153 (SCI: 000380377000253, EI: 20160701931344)
2014:
2013: