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学术论文

专著: 

  1. 田文超,刘焕玲,张大兴,电子封装结构设计,2017,西安电子科技大学出版社(西安电子科技大学教材和研究生精品立项教材资助)
  2. 田文超,娄利飞,微机电技术,2014,西安电子科技大学出版社(“十二五”国家优秀重点图书出版规划项目资助,陕西省出版基金资助,西安电子科技大学优秀教材二等奖)
  3. 田文超,电子封装、微机械与微系统,2012,西安电子科技大学出版社(国家“十二五”规 划教材)
  4. 田文超,微机电系统(MEMS)原理、设计和分析,2009,西安电子科技大学出版社

 

 


文章:

  

   2018:

  1. Yongkun Wang, Tianran Ma, Wenchao Tian, Junjie Ye, Xing Wang and Xiangjun Jiang, Electroactive shape memory properties of graphene/epoxy-cyanate ester nanocomposites, Pigment & Resin Technology, 2018,47 (1) :72-78 (SCI: 000424986200009, JCR:Q4, Impact factor:0.486, 5-Year Impact Factor: 0.708)
  2. Wenchao Tian, Ping Li, Linxiao Yuan,  Research and Analysis of MEMS Switches in Different Frequency Bands, Micromachines, 2018, 9(4), 185 (DOI: 10.3390/mi9040185, JCR: Q2, Impact Factor: 2.222, 5-Year Impact Factor: 2.236)
  3. Wenchao Tian, Zongyu Ling, Wenbo Yu, Jing Shi, A Review of Piezoelectric Energy Harvester Research, Applied Sciences-Basel, 2018, 8(4), 645 (DOI: 10.3390/app8040645, JCR: Q3, Impact Factor: 1.689, 5-Year Impact Factor: 1.855)
  4. Jing Shi, Xiao Liu, Wenchao Tian, High energy-storage properties of Bi0.5Na0.5TiO3-BaTiO3-SrTi0.875Nb0.1O3 lead-free relaxor ferroelectricsJournal of Materials Science & Technology2018,34(12), 2371 (DOI: 10.1016/j.jmst.2018.06.008, JCR: Q1, Impact Factor: 3.609, 5-Year Impact Factor: 3.28)
  5. Wenchao Tian, Xiaohan Liu, Wenbo Yu, Research Progress of Graphene Gas Sensor: A review, Applied Sciences-Basel, 2018, 8, 1118 (DOI: 10.3390/app8071118, JCR: Q3, Impact Factor: 1.689, 5-Year Impact Factor: 1.855)
  6. Wenchao Tian, Tianran Ma, Xiaohan Liu,  TSV Technology and High Energy Heavy Ions Radiation Impact Review, Electronics, 2018, 7(7), 112 (DOI: 10.3390/electronics7070112, JCR: Q2, Impact Factor: 2.11) 
  7. Wenchao Tian, Wenbo Yu, Xiaohan Liu, Yongkun Wang and Jing Shi, A review of the characteristics, synthesis and thermodynamics of type-II Weyl semimetal WTe2, Materials, 2018, 11, 1185 (DOI: 10.3390/ma11071185, JCR: Q2, Impact Factor: 2.467, 5-Year Impact Factor: 3.325)
  8. Wenchao Tian, Daowei Wu,  Zhiqiang Chen, Yongkun Wang, Application of Genetic Algorithlm in M×N Reconfigurable Antenna Array Based on RF MEMS Switches, Modern Physics Letters B, 2018, 32(30) (DOI:10.1142/S0217984918503657, JCR:Q4, Impact Factor: 0.731, 5-Year Impact Factor: 0.628)

 

   

2017:

 

  1. Wenchao Tian, Wenhua Li, Xiaohan Liu, Yongkun Wang, Molecular dynamics study on resonance properties of nano resonator based on graphene nanosheet with two types of vacancy defects, Applied Sciences-Basel, 2017, 7 (1): 79-1-9 (SCI: 000395485900077, JCR: Q3, Impact Factor: 1.689, 5-Year Impact Factor: 1.855)
  2. Wenchao Tian, Wenhua Li, Wenbo Yu and Xiaohan Liu, A review on lattice defects in graphene: types, generation, effects and regulation, Micromachines, 2017, 8(5), 163  (SCI:000404117900031, JCR: Q2, Impact Factor: 2.222, 5-Year Impact Factor: 2.236)
  3.  3.   Wenchao Tian, Wenbo Yu, Jing Shi and Yongkun Wang, The property, preparation and application of topological insulators: A review, Materials, 2017, 10(7), 814  (SCI: 000406683000131, JCR: Q2, Impact Factor: 2.467, 5-Year Impact Factor: 3.325)
  4. Wenchao Tian, Xiaotong Zhang, Zhiqiang Chen, Performance analysis of MEMS phase shifters based on RF MEMS switches: A review, Recent Patents on Mechanical Engineering2017, 10(2):126-139
  5. Zhiqiang Chen, Wenchao Tian, Xiaotong Zhang, Effect of surface asperities on the capacitances of capacitive RF MEMS switches, Journal of Micromechanics and Microengineering, 2017, 27(3): 034002-1-10 (SCI: 000395708500001, JCR: Q2, Impact Factor: 1.888, 5-Year Impact Factor: 1.954)
  6. Yongkun Wang, Wenchao Tian, Xiaohan Liu and Junjie Ye, Thermal sensitive shape memory behavior of epoxy composites reinforced with silicon carbide whiskers, Applied Scinces-Basel, 2017, 7(1): 108-1-10 (SCI: 000395485900105, JCR: Q3, Impact Factor: 1.689, 5-Year Impact Factor: 1.855)
  7. Jing Shi, Wenchao Tian, Electric-field induce phase transition and fatigue behaviors of (Bi0.5+x/2Na0.5-x/2) 0.94Ba0.06Ti1-xFexO3 ferroelectric, Journal of the American Ceramic Society2017, 100(3): 1080-1090 (SCI: 000397503100029, JCR: Q1, Impact Factor: 2.956, 5-Year Impact Factor: 2.971)

  8. Yongkun Wang, Wenchao Tian, Guangming Zhu, Electro-induced shape memory nanocomposite containing conductive carbon nanotubes, Journal of Nanoscience and Nanotechnology, 2017, 17(6): 3973-3679 (SCI:000402483900004, JCR: Q3, Impact Factor: 1.338, 5-Year Impact Factor: 1.105)

  9. Zhiqiang Chen, Wenchao Tian, Xiaotong Zhang,  Analysis of a novel double driving signal line and driving electrodes separated RF MEMS switch, Modern Physics Letters B, 2017, 31(11): 1750113-1-18 (SCI: 000399832300003, JCR: Q4, Impact Factor: 0.731, 5-Year Impact Factor: 0.628)

  10. Yi Tian, Xinbo Huang, Wenchao Tian, Yongcan Zhu, Long Zhao, Ye Zhang, Study on the hybrid ion-flow field of HVDC and HVAC transmission lines by the nodal discontinuous Galerkin time-domain method, IET Generation, Transmission & Distribution, 2017, 11(1): 209-217 (SCI: 000393751800022, JCR: Q2, Impact Factor: 2.618, 5-Year Impact Factor: 2.874)
  11. Zhiqiang Chen, Wenchao Tian, Xiaotong Zhang, Yongkun Wang, Effects of deposition parameters on surface roughness and consequent electromagnetic performances of capacitive RF MEMS switches: A review, Journal of Micromechanics and Microengineering, 2017, 27(11):113003-1-26 (SCI: 000413110700002, JCR: Q2, Impact Factor: 1.888, 5-Year Impact Factor: 1.594)
  12. Wenchao Tian, Zhanghan Zhao, Electrical performance simulation of 2.5D package, 2nd International Conference on Modelling, Simulation and Applied Mathmatics (MSAM 2017), 2017, March, 26-27, Bangkok, Thailand, vol. 132, pp. 5-7 (SCI:000417222100002)

   

   2016:

 

  1. Wenchao Tian, Zhiqiang Chen, Yanrong Cao, Analysis and test of a new MEMS micro-actuator, Microsystem Technologies, 2016, 22(5): 943-952 (SCI: 000374570300005, JCR: Q3, Impact Factor: 1.581, 5-Year Impact Factor: 1.33)
  2. Wenchao Tian, Xiangyang Zhang, Zhiqiang Chen, Haoyue Ji, A review of graphene on NEMS, Recent Patents on Nanotechnology, 2016, 10(1): 3-10 (SCI: 000373124800003, JCR: Q3, Impact Factor: 1.475, 5-Year Impact Factor: 1.884)

  3. Yongkun Wang, Wenchao Tian, Guangming Zhu, Jianqiang Xie, Thermomechanical and shape memory properties of SCF/SBS/LLDPE composites, Chinese Journal of Polymer Science, 2016, 34(11):1354-1362 (SCI: 000386709500006, JCR: Q2, Impact Factor: 2.016, 5-Year Impact Factor: 1.582)

  4. Yongkun Wang, Wenchao Tian, Jianqiang Xie, Yan Liu, Thermoelectric responsive shape memory graphene/hydro-epoxy composites for actuators, Micromachines, 2016, 7(8): 145-154 (SCI: 000382467700017, JCR: Q2, Impact Factor: 2.222, 5-Year Impact Factor: 2.236)

  5. Yongkun Wang, Junjie Ye, Wenchao Tian, Shape memory polymer composites of poly (styrene-b-butadiene-b-styrene) copolymer / liner low density polyethylene / Fe3O4 nanoparticles for remote activation, Applied Sciences, 2016, 3: 333-342 (SCI: 000389532800024, JCR: Q3, Impact Factor: 1.689, 5-Year Impact Factor: 1.855)

  6. Yi Tian, Xinbo Huang, Wenchao Tian, Hybrid method for calculation of ion-flow fields of HVDC transmission lines, IEEE Transactions on Dielectrics and Electrical Insulation, 2016, 23(5): 2830-2839 (SCI: 000389215000039, JCR: Q2, Impact Factor: 1.774, 5-Year Impact Factor: 2.048)

  7. Wenchao Tian, Haoyue Ji, Recent research of electromagnetic characteristics in wire bonding, Recent Patents on Mechanical Engineering, 2016, 9(2): 101-111 (EI: 20162402501958)

  8. Wenchao Tian, Qiang Chao, Jing Shi, Reconfigurable antennas based on RF MEMS switches, Recent Patents on Mechanical Engineering, 2016, 9(3): 230-240 (EI: 20163802813099)

  9. Wenchao Tian, Hao Cui, A simplification method of solder joints for thermal analysis in 3D packages, 17th International Conference on Electronic Packaging Technology, ICEPT, 16-19 Aug. 2016, Wuhan, China; Publisher: IEEE, Piscataway, NJ, USA, 812-815 (SCI: 000389835800177, EI: 20164502990900)

  10. Wenchao Tian, Hao Cui, A simplification method of TSV interposer for thermal analysis in 3D packages, 17th International Conference on Electronic Packaging Technology, ICEPT, 16-19 Aug. 2016, Wuhan, China; Publisher: IEEE, Piscataway, NJ, USA, 820-823 (SCI: 000389835800179, EI: 20164502990902)

  11. Wenchao Tian, Wenhua Li, Molecular dynamics study on vibrational properties of graphene nanoribbon resonator, Journal of Computational and Theoretical Nanoscience2016, 13(10): 7460-7466

 

    2015:

 

  1. Wenchao TianZhiqiang Chen, Analysis of bistable inductive micro switch based on surface micro size effect, Applied Surface Science, 2015, 334: 32-39 (SCI: 000351609900007, JCR: Q1, Impact Factor: 4.439, 5-Year Impact Factor: 3.743)

  2. Wenchao Tian Sanjuan Wei. Current research status of microchannel thermal management technology, Recent Patents on Mechanical Engineering, 2015, 8: 1-12 (EI: 20153401206634)

  3. Wenchao Tian, Qiang Chao, Zhiqiang Chen, Failure mechanisms and reliability analysis of RF MEMS switches, Recent Patents on Mechanical Engineering, 2015, 8: 201-210 (EI: 20155101694062)

  4. Wenchao TianHaoyue Ji, Reliability analysis and thermal resistance degradation of high power chip under harsh  environment, 16th International Conference on Electronic Packaging Technology, ICEPT, 11-14 Aug. 2015, Changsha, China; Publisher: IEEE, Piscataway, NJ, USA, 1139-1144 (SCI:000380377000251, EI: 20160701931415)

  5. Wenchao Tian Sanjuan Wei, Reliability analysis of and experiment test on SAC305 solder balls, 16th International Conference on Electronic Packaging Technology, ICEPT, 11-14 Aug. 2015, Changsha, China; Publisher: IEEE, Piscataway, NJ, USA, 1134-1138 (SCI: 000380377000250, EI: 20164502990902)

  6. Wenchao TianZhiqiang Chen, Analysis of a double-phase regulation and an ultra wideband tunable micro electromechanical system resonator, 2015 16th International Conference on Electronic Packaging Technology, ICEPT, 11-14 Aug. 2015, Changsha, China; Publisher: IEEE, Piscataway, NJ, USA, 1149-1153 (SCI: 000380377000253, EI: 20160701931344)

 

   2014:

 

  1. 田文超, 陈志强, 贾建援, 低压大位移静电微驱动器驱动机理分析, 西安电子科技大学学报, 2014, 41(2): 86 - 89 (EI: 20141817659861)
  2. 2.  Wenchao Tian,    Jianglei Hu, High-power and high-reliability RF MEMS switch reviewRecent Patents on Mechanical Engineering, 2014, 7(2): 105-112 (EI: 20143118006880)
  3. Tian Wenchao, Guan Rongcheng, Anti-vibration structure analysis and optimizing on BGA packaging module, 15th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP,12-15 Aug. 2014, Chengdu, China; Publisher: IEEE, Piscataway, NJ, USA, 524-528 (SCI: 000366592100120, EI: 20144400133929)
  4. Tian Wenchao, Guan Rongcheng,Effect and experiment of screw locations on BGA viscoplastic fatigue life, 15th International Conference on Electronic Packaging Technology (ICEPT), 12-15 Aug. 2014, Chengdu, China; Publisher: IEEE, Piscataway, NJ, USA, 529-534 (SCI: 000366592100121, EI: 20144400134023)
  5. 田文超陈志强新型低电压大变形微驱动器数值求解及仿真计算物理201431(2): 223-229
  6. 田文超, 陈志强, 新型双向加载MEMS微执行器动力学分析, 纳米技术与精密工程,2014, 12(5): 334-339

 

    2013:

 

  1. Tian Wenchao,  Yang Yintang, Molecular dynamics analysis of “stiction” based on multi-body EAM potential function, Journal of Computational and Theoretical Nanoscience, 2013, 10(4): 848-852
  2. Tian Wenchao, Jia Jianyuan, Dynamic analysis of bistable inductive micro-switch, Advanced Science Letters, 2013,19(6): 1686-1690
  3. Tian Wenchao,  Chen Zhiqiang, Modeling and micro scale analyzing of micro-switch applied in all-optical communication, Journal of Theoretical and Applied Information Technology, 2013, 48(1): 454-458
  4. Tian Wenchao,  Yang Liqin, Principle, characteristic and application of scanning probe microscope series, Recent Patents on Mechanical Engineering, 2013, 6(1): 48-57

 

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