Xidian Meeting Xidian Guide About Help Search Home Login Control Panel AddBookMark Tian Wenchao's MessageBoard
Profile

Dr. Tian Wenchao

Professor of School of Electro-Mechanical Engineering, Xidian University

Contact Information

Address: 

Xidian University, No.2 South Taibai Road, Xi'an,Shaanxi Province, China

Postcode: 710071

Email:wctian@xidian.edu.cn, tianwenchao@21cn.com

Tel: +86-29-88202954

Introduction

1987.9-1991.7:  Bachelor degree of Electronic Equipment Structure in Xidian University

1996.9-1999.6:  Master degree of Mechanical Manufacturing in Xidian University

2000.9-2004.6:  Ph.D. degree of Mechanical Manufacturing and Automation in Xidian University

2006.12-2007.12: Working as a guest professor in Institute of Microsystem (IMTEK), University of Freiburg, Germany

2006.10-2008.10: Working in Microelectronics and Solid Electronics Post-doctoral working stations in Xidian University

 

 Member of MEMS Standardization Committee of China

• Board member of the 2nd Council of Micro and Nano-meter SocietyChina

Senior Member of the Chinese Society of Theoretical and Applied Mechanics (CSTAM)

Senior Member of Chinese Mechanical Engineering Society

Guest editor of "Recent Patents on Mechanical Engineering"and other international journals

Evaluation expert of the National Science and Technology Award expert database

Evaluation expert of the Natural Science Foundation of China (NSFC) expert database

Evaluation expert of “863” Program

Evaluation expert of International Scientific and Technological Cooperationexpert database

Evaluation expert of the National Innovation Fundexpert database

Evaluation expert of the National Postdoctoral Sustentation Fund expert database

Evaluation expert of the National Doctoral Specialties Fund expert database

 

At present work as the head of Department of Electronic Packaging, Xidian University,principal of Electronic Packaging Technology of National Specialty,principal of Precision Instruments and Mechanical Subject, Xidian University.As the person in charge to participate in the project include the National Natural Science Fund, assembly research, natural science foundation of Shaanxi Province, Xi'an city innovation fund and the postdoctoral sustentation fund more than 30. Published 3 monographs independently. Published more than 110 papers, in which SCI / EI included more than 90 papers.

Research Interests

1.MEMS Technology: Design and simulation of intelligent micro sensor and actuator, performance analysis and design of micro/nano devices and micro electromechanical system, dynamic simulation and test of micro/nano devices.

2.Electronic Packaging and Microassembly Technology: The thermal, electromagnetic, vibration and impact, vibration shock,creep and stress relaxation, failureand lifetime, reliability analysis of package device and circuit board and;Performance analysis of 3D laminated board, TSV, SIP, micro system technology, other advanced packaging technology and microassembly technology.

3.Photoelectric detection and electromechanical control: Stress and strain detection of MOEMS, conversion and transmission of opto-electronic information, design and processing of high-end special servo-drive control technology, opto-electronic sensor detection and system integration technology.

版权声明:未经西安电子科技大学以及个人主页教师本人许可不得复制,转载传播本主页内容或用于任何商业用途,如需转载请征得主页所有者同意,并附上主页链接.
Xidian University Homepage sitemap | | Tian Wenchao's MessageBoard | update by :2018-07-15 | |
Copyright © 2011-2016 Xidian University ICP 021284(05016169) Powered by XIDIANNIC & SEENIC