Dr. Tian Wenchao
Professor of School of Electro-Mechanical Engineering, Xidian University
Master\\'s supervisor, doctoral supervisor
Doctoral enrollment Discipline: Mechatronic Engineering/080202, Instrument Science and Technology/080402
Master\\'s enrollment Discipline: (academic degree) Mechanical Engineering/080200, Instrument Science and Technology/080400; (Professional Degree) Machinery/085500, Electronic Information/085400
Address:
Xidian University, No.2 South Taibai Road, Xi\\'an,Shaanxi Province, China
Postcode: 710071
Email:wctian@xidian.edu.cn, 499422964@qq.com
Tel: +86-29-88202954
Office location: North Campus-Main Building-3 District-322
Founder and person in charge of the national specialty specialty of “Electronic Packaging Technology” (this specialty ranked first in the “2017 Chinese Science Evaluation Center” and “2017 Wuhan University China Education Quality Evaluation Center Chinese University Undergraduate Professional Rankings”, and It is the only first, not tied; Xidian University is the only school in the country that has a special national-level specialization in packaging), deputy director of the Academic Committee of Xi’an Intelligent Instruments and Packaging Testing Key Laboratory, Advanced Packaging and Complex High-density Assembly Research Center Director, Deputy Chairman of the National Electronic Packaging Technology Textbook Writing Committee.
Learning experience：
1987.9-1991.7: Bachelor degree of Electronic Equipment Structure in Xidian University
1996.9-1999.6: Master degree of Mechanical Manufacturing in Xidian University
2000.9-2004.6: Ph.D. degree of Mechanical Manufacturing and Automation in Xidian University
2006.12-2007.12: Working as a guest professor in Institute of Microsystem (IMTEK), University of Freiburg, Germany
2006.10-2008.10: Working in Microelectronics and Solid Electronics Post-doctoral working stations in Xidian University
Social work:
• Member of MEMS Standardization Committee of China
• Board member of the 2nd Council of Micro and Nano-meter SocietyChina
• Senior Member of the Chinese Society of Theoretical and Applied Mechanics (CSTAM)
• Senior Member of Chinese Mechanical Engineering Society
• Guest editor of "Recent Patents on Mechanical Engineering"and other international journals
• Evaluation expert of the National Science and Technology Award expert database
• Evaluation expert of the Natural Science Foundation of China (NSFC) expert database
• Evaluation expert of “863” Program
• Evaluation expert of International Scientific and Technological Cooperationexpert database
• Evaluation expert of the National Innovation Fundexpert database
• Evaluation expert of the National Postdoctoral Sustentation Fund expert database
• Evaluation expert of the National Doctoral Specialties Fund expert database
Secretary of the Electronic Packaging Department as the branch secretary, the founder and person in charge of the national specialty specialty of "Electronic Packaging Technology" (the major is listed in the "2017 Chinese Science Evaluation Center" and "2017 Wuhan University China Education Quality Evaluation Center Chinese University Undergraduate Rankings" ", Ranked first, and the only one, not tied; Xidian University is the only school in the country with a national specialty in packaging.
Part-time job in the society: Deputy Chairman of the National Electronic Packaging Technology Textbook Compilation Committee (ranked first deputy director)
1．MEMS Technology: Design and simulation of intelligent micro sensor and actuator, performance analysis and design of micro/nano devices and micro electromechanical system, dynamic simulation and test of micro/nano devices.
2．Electronic Packaging and Microassembly Technology: The thermal, electromagnetic, vibration and impact, vibration shock,creep and stress relaxation, failureand lifetime, reliability analysis of package device and circuit board and;Performance analysis of 3D laminated board, TSV, SIP, micro system technology, other advanced packaging technology and microassembly technology.
3．Photoelectric detection and electromechanical control: Stress and strain detection of MOEMS, conversion and transmission of opto-electronic information, design and processing of high-end special servo-drive control technology, opto-electronic sensor detection and system integration technology.