Teaching
- Courses:
- Graduate courses: MEMS design (degree course), vibration control (degree course), micro-scale mechanics, micro-nano technology
- Undergraduate courses: engineering mechanics (compulsory course), MEMS packaging technology (compulsory course), numerical control technology, mechanical CAD/CAM
- Teaching awards
- Tian Wenchao, Liu Huanling, Zhang Daxing, Electronic Packaging Structure Design, First Prize of Excellent Textbook of Xidian University, 2019
- Tian Wenchao, Jia Jianyuan, Gao Hongwei, Cao Yanrong, Cui Chuanzhen, facing the international high-end manufacturing field, creating a first-class electronic packaging technology professional training mechanism, second prize of school-level excellent teaching achievements, 2017
- Tian Wenchao, Lou Lifei, MEMS, Second Prize of Excellent Textbook of Xidian University, 2017
- Tian Wenchao, School-level Outstanding Contribution Award, 2015
- Create a new undergraduate major in electronic packaging technology, cultivate high-end electronic manufacturing innovative talents, first prize of school-level outstanding teaching achievements, 2014
- Highlight professional characteristics, pay attention to practical links, cultivate high-quality electronic packaging professional and technical personnel, second prize of school-level outstanding teaching achievements, 2012
- Tian Wenchao, Principle, Design and Analysis of Micro-Electro-Mechanical System (MEMS), Second Prize of Excellent Textbook of Xidian University, 2011
- Teaching Reform Project
- Tian wenchao, Wang weidong, Shi jing, Wang yongkun, 《MEMS Design》excellent course construction, 2020.1
- Tian Wenchao, MEMS and Packaging Technology Teacher Course, 2017
- Tian Wenchao, Wang Yongkun, Shi Jing, Facing the construction of "double first-class", build a professional training system for composite electronic packaging technology, key project, 2016
- Tian Wenchao, etc., adapt to national needs, highlight electromechanical characteristics, improve electronic packaging technology, school-level teaching reform, key project, 2013
- Teaching Reform Paper
- Tian Wenchao, Shi Jing, Research Report on Research and Development and Social Needs of Electronic Packaging Graduates, China Electronics Education, 2017, 2: 10-17
- Tian Wenchao, Shi Jing, Investigation report on the cultivation of electronic packaging technology colleges and talent institutions, China Electronics Education, 2017, 3: 86-95
- Textbook project
- Tian Wenchao, MEMS/NENS and Advanced Packaging Technology, 2020, Xidian University Press (Key support from Xidian Science and Technology Monograph Publishing Fund)
- Tian Wenchao, Packaging Design, School-level Excellent Graduate Textbook Project, Key Project, 2015
- Tian Wenchao, Micro-Electro-Mechanical and Micro-System, School-level Excellent Graduate Textbook Project, Key Project, 2014
- Tian Wenchao, etc., electronic packaging structure design, school-level textbook project, key project, 2014
- Tian Wenchao, etc., MEMS principle, design and analysis, school-level textbook project, key project, 2012
- New experiment new equipment project
- Tian Wenchao, Shi Jing, Cui Hao, Research on Electrical Characteristics of Wire Bonding in IC Packaging, General Project, 2017
- Tian Wenchao, Wang Yongkun, Chen Zhiqiang, Development of reconfigurable antenna package based on MEMS radio frequency switch, key project, 2016
- Jing Shi, Wenchao Tian, Yongkun Wang, Preparation of high-performance KNN ceramics for vibration energy harvesting, general project, 2016
- "National Innovation" and "Provincial Innovation" guidance
- Song Chenghao, etc., Collection and Verification of Metro Planning Route Based on APP Application, "Guochuang", 2017
- Liu Chunlin et al. Research on the switch control system of frequency reconfigurable antenna based on STM32, "Guochuang", 2017
- Yu Zhongwei, etc., Intelligent Fire Monitor Automatic Tracking and Servo Drive System Design, "Guochuang", 2014
- Cao Yifan, etc., Non-contact Infant Surface Temperature Tester, "Guochuang", 2014
- Lou Shunxi, etc., Multifunctional Precision Stress-Strain Optical Tester, "Shenchuang", 2013
- Li Zhi, etc., Multifunctional PCB Deformation and Testing Institution, "Provincial Innovation", 2013
- Yuan Wenda, etc., 128-channel data acquisition display alarm system, "Provincial Creation", 2013