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学术论文

专著： 

  1. 田文超，陈志强，杨宇军，辛菲，电子封装、微机电与微系统（第2 版），西安电子科技大学出版社，2022.11（西安电子科技大学优秀教材一等奖）

  2. 田文超，刘焕玲，张大兴，电子封装结构设计，2017，西安电子科技大学出版社（2022年陕西省优秀教材二等奖，西安电子科技大学教材和研究生精品立项教材资助）

  3. 田文超，娄利飞，微机电技术，2014，西安电子科技大学出版社（“十二五”国家优秀重点图书出版规划项目资助，陕西省出版基金资助，西安电子科技大学优秀教材二等奖）

  4. 田文超，电子封装、微机械与微系统，2012，西安电子科技大学出版社（国家“十二五”规 划教材）

  5. 田文超，微机电系统（MEMS）原理、设计和分析，2009，西安电子科技大学出版社

 

文章：

2024：

  1. Tian Wenchao, Hou Huahua, Dang Haojie, Cao Xinxin, Li Dexin, Chen Si, Ma Bingxu, Progress in Research on Co-Packaged Optic，Micromachines, 2024，15（8），DOI：https://doi.org/10.3390/mi15101211（SCI:01342424200001,  JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  2. Wenchao Tian , Haojie Dang , Dexin Li , Yunhao Cong  and Yuanming Chen，Reliability Simulation Analysis of TSV Structure in Silicon Interposer under Temperature Cycling，Micromachines, 2024，15（8），DOI：https://doi.org/10.3390/mi15091087（SCI: 001306007500001,  JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  3. Wenchao Tian , Dexin Li , Haojie Dang , Shiqian Liang , Yizheng Zhang , Xiaojun Zhang , Si Chen  and Xiaochuan Yu，Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging，Micromachines, 2024，15(9)，DOI：https://doi.org/10.3390/mi15091087（SCI: 001323725600001,  JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  4. Wang Yongkun，Liu Haozheng，Huo Linghua，Li Haobin，Tian Wenchao，Ji Haoyue，Chen Si，Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review，Micromachines, 2024，15（4），DOI：https://doi.org/10.3390/mi15040422（SCI: 001209932300001,  JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  5. Zhang Yiming，Tian Wenchao，Wang Hongyue，Wang Lei，Yang Zhili，Shao Weiheng，Chen Zejian，Zhou Bi，High-Frequency Transmission Characteristic Analysis of TSV-RDL Interconnects，IEEE Transactions on Components Packing and Manufacturing Technology，2024，14（1），89-97，DOI：10.1109/TCPMT.2023.3343712 （SCI:001178135100020,  JCR: Q3, Impact factor:2.2, 5-year Impact: 2.2）

  6. Wenchao Tian, Xuyang Chen, Guoguang Zhang, Yuanming Chen, Jijun Luo，Delamination of Plasticized Devices in Dynamic Service Environments，Micromachines, 2024，15（3），DOI：https://doi.org/10.3390/mi15030376（SCI:001193027900001,  JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)
  7. Zhao Li, Wenchao Tian, Wenbin Li, Sixian Wu, Yongkun Wang, Hanyang Xu, Surface Roughness Analysis of Cu Seed Layer deposited on α-Ti Diffusion barrier layer: A molecular dynamics simulation, J. Appl. Phys.，2024, 135(5), 055301,DOI:10.1063/5.0190871（SCI:001192165200008,  JCR: Q2, Impact factor:3.2, 5-year Impact: 2.2)
  8. 田文超，谢昊伦，陈源明，赵静榕，张国光，人工智能芯片先进封装技术（封面文章），电子与封装, 2024, 24 (1): 010204（入选2023-2024《电子与封装》优秀论文， 2/15）

  9. Liu Xiao，Wang Jicong，Zhu Fangyuan，Li Yanrui，Tian Wenchao, Wang Weijia，Guo Ruiyun，Liu Laijun，Shi Jing，Surface oxygen vacancy engineering in weak Bi-O bonded ferroelectric bismuth sodium titanate for boosting the photocatalytic CO2 reduction reaction，Journal of Materials Chemistry A，2024,3，DOI：10.1039/d4ta01030b，（SCI：001190349300001，JCR: Q1，Impact factor:11.9, 5-year Impact: 11.6）

2023：

  1. Wenchao Tian, Shuaiqi Zhang, Wenbin Li, Yuanming Chen, Jingrong Zhao, Fei Xin, Yingying Qian and Wenhua Li，Study on Cavitation, Warpage Deformation, and Moisture Diffusion of Sop-8 Devices during Molding Process，Micromachines, 2023，14（12），DOI：https://doi.org/10.3390/mi14122175（SCI:001130565100001, JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  2. Tian Wenchao, Li Wenbin, Zhang Shuaiqi, Zhou Liming, Wang Heng, Temperature Cycle Reliability Analysis of an FBAR Filter-Bonded Ceramic Package, Micromachines, 2023，14（11），DOI：10.3390/mi14112132 （SCI: , JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  3. Tian Wenchao，Gao Ran，Gu Lin，Ji Haoyue，Zhou Liming，Three-Dimensional Integrated Fan-Out Wafer-Level Package Micro-Bump Electromigration Study，Micromachines, 2023，14（6），DOI：10.3390/mi14061255 （SCI:001015038700001 , JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  4. Tian Wenchao，Wu Sixian，Li Wenhua，Research of Vertical via Based on Silicon, Ceramic and Glass， Micromachines,2023，14（7），DOI：10.3390/mi14071391（SCI:001037628000001 , JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  5. Ji Haoyue，Tian Wenchao，Qian Hongwen，Sun Xiaodong，Wang Yongkun，Gu Lin，Zheng Lihua，Research on Surface Morphology of Gold Micro Bumps Based on Monte Carlo Method， Micromachines, 2023，14（7），DOI：10.3390/mi14071345（SCI:001036571400001 , JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  6. Xu, Hanyang; Huang, Jiabo; Tian, Wenchao; Li, Zhao，Thermal Performance Optimization of Integrated Microchannel Cooling Plate for IGBT Power Module，Micromachines,2023，14（8），DOI：10.3390/mi14081498（SCI:001055711200001 , JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  7. Lv Hanghang，Cao Yanrong，Ma Maodan，Wang Zhiheng，Zhang Xinxiang，Chen Chuan，Wu Linshan，Lv Ling，Zheng Xuefeng，Wang Yongkun，Tian, Wenchao，Ma Xiaohua，Effect of P-Type GaN Buried Layer on the Temperature of AlGaN/GaN HEMTs，Micromachines, 2023，14（7），DOI：10.3390/mi14071457（SCI: 001036503200001, JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  8. Wang Zhiheng, Cao Yanrong, Zhang Xinxiang, Chen Chuan, Wu Linshan, Mamaodan,  Lv Hanghang, Lv Ling, Zheng Xuefeng, Tian Wemchao, Ma Xiaohua, Hao Yue, Simulation of Single-Event Transient Effect for GaN High-Electron-Mobility Transistor，Micromachines, 2023，14（10），DOI：10.3390/mi14101948（SCI:001095210800001 , JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  9. Wang Yiyi，Wang Pu，Liu Laijun，Wang Yuyin，Zhao Yingying，Tian Wenchao，Liu Xiao，Zhu Fangyuan，Shi Jin，Defect Dipole Behaviors on the Strain Performances of Bismuth Sodium Titanate-Based Lead-Free Piezoceramics，Materials，2023,16（11），DOI：10.3390/ma16114008，（SCI:001004870700001 , JCR: Q2, Impact factor:3.748, 5-year Impact: 4.042）

  10. Hao Cui, Wenchao Tian, Hanyang Xu, Heng Wang, Jiabo Huang, Chunxi Peng and Zhiqiang Chen，The Reliability of the Complex Components under Temperature Cycling, Random Vibration, and Combined Loading for Airborne Applications，Crystals, 2023, 13，473，DOI: 10.3390/ cryst13030473，（SCI: 000955980500001, JCR: Q2, Impact factor:2.67, 5-year Impact: 2.688）

  11. Hao Cui, Wenchao Tian, Yiming Zhang，Zhiqiang Chen，The Study of the Reliability of Complex Components during the Electromigration Process，Micromachines, 2023, 14, 499 DOI:10.3390/mi14010104（SCI: 000958801400001, JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  12. 田文超，钱莹莹，赵静榕，李昭，李彬，基于碳化硅器件微系统封装研究进展，微电子学与计算机，2023，40(1)，DOI：10.19304/J.ISSN1000-7180.2022.0717

  13. Shi Jing，Dong Rizhuang，He Jiayi，Wu, Daowei，Tian Wenchao，Liu Xiao，Regulating ferroelectric polarization and dielectric properties of BT-based lead-free ceramics，Journal of Alloys and Compounds，2023，933，DOI：10.1016/j.jallcom.2022.167746（SCI：000917433100004，JCR: Q1, Impact factor:6.371,5-Year Impact Factor:5.341）

  14. 张国光，田文超，刘美君、从均昊、陈思、王永坤，铜带缠绕型CCGA的加工用以参数优化，电子与封装，2023，23（2）

  15. Xin Fei，Wang Qiuwang，Yan Yuying，Tian, Wenchao，Experimental investigation on the active thermal management of grooved flat heat pipe under the electrohydrodynamic effect，International Communications in Heat and Mass Transfer，2023，141，DOI：10.1016/j.icheatmasstransfer.2022.106604，（SCI：000921462500001，JCR: Q1, Impact factor：6.782，5-Year Impact Factor:6.39）

  16. 田文超，凸点互联电沉积工艺优化（特约报告），ICANX2023西安科学大会，特邀报告，2023.5.20， 中国，西安

  17. 田文超，印刷板组件SMT工艺与多场耦合建模及可靠性仿真技术研究（特邀报告），中国微米纳米技术学会第25届学术年会暨14届国际会议，特邀报告，2023.10.20-23，中国，深圳

  18. 田文超，徐瀚洋，金属凸点沉积及电迁移寿命预测研究（特邀报告），中国微米纳米技术学会第25届学术年会暨14届国际会议，特邀报告，2023.10.20-23，中国，深圳

  19. 田文超，田明方，庄章龙，赵静榕，基于立体视觉的IGBT针高检测，电子与封装，246（10），2023.10

  20. 田文超，徐瀚洋，基于ANSYS的电子器件组件可靠性分析、寿命预测与失效率预测，特邀报告，第九届纳米结构汉能材料及其应用技术学术研讨会，2023.11.26，中国，西安

2022:

  1. Chen Zhiqiang, Tian Wenchao Effect of Surface Roughness on the Electrical Performances of CPW Transmission Lines Used in Future Ultra-High Frequency Applications, Micromachines, 2022, 14(1), DOI:10.3390/mi14010104（SCI：000916267600001，JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  2. Ma Maodan, Cao Yanrong, Lv Hanghang, Wang Zhiheng, Zhang Xinxiang, Chen Chuan, Wu Linshan, Lv Ling, Zheng Xuefeng, Tian Wenchao, Ma Xiaohua, Hao Yue, Effect of Acceptor Traps in GaN Buffer Layer on Breakdown Performance of AlGaN/GaN HEMTs, Micromachines, 2022, 14(1), DOI: 10.3390/mi14010079（SCI：36677140，JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  3. Hao Cui, Wenchao Tian, Xutao Zhao, Shuai Chen, Zhiqiang Chen, Effect of the reflow process on IMC growth for different devices and complex components，Smart Materials and Structures，2022，31（11），DOI：10.1088/1361-665X/ac9ba9（SCI：000877319800001， JCR:Q2, Impact factor:4.143, 5-Year Impact Factor:3.938）

  4. Wenchao Tian, Bin Li, Zhao Li, Hao Cui, Jing Shi, Yongkun Wang,Jingrong Zhao， Using Chiplet encapsulation technology to achieve Processing-in-Memory functions，Micromachines, 2022，13(10)，1790，DOI:10.3390/mi13101790（SCI：000857604700001，JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  5. Wenchao Tian, Zhao Li, Yongkun Wang，Guoguang Zhang，Height Uniformity Simulation and Experimental Study of Electroplating Gold Bump for 2.5D/3D Integrated Packaging，Micromachines, 2022, 13(9), 1057， DOI:10.3390/mi13040547,（SCI:000857604700001, JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  6. Wenhua Li, Tian Wenchao，Molecular Dynamics Analysis of Graphene Nanoelectromechanical Resonators Based on Vacancy Defects，Nanomaterials，2022，12(10), 1722; DOI:10.3390/nano12101722 (SCI:000801755900001, JCR: Q1, Impact Factor:5.719, 5-Year Impact factor:5.81)

  7. Shi Jing, Rao Rongrong, Tian Wenchao, Xu Xiaomin, Liu, Xiao, Anomalous electrical performance of A-site double-bivalent-doped Bi0.49Na0.5TiO3-delta ceramics from nominal oxygen deficiency to excess, Ceramics International, 2022, 48:5210-5216, DOI: 10.1016/j.ceramint.2021.11.061 (SCI: 000743585100001,  JCR:Q1, Impact Factor: 4.527, 5-Year Impact factor: 4.049)

  8. Jing Shi, Yunxia Zhao, Jiayi He, Tangyuan Li, Fangyuan Zhu, Wenchao Tian, and Xiao Liu，Deferred polarization saturation boosting superior energy-storage efficiency and density simultaneously under moderate electric field in relaxor ferroelectrics, ACS Applied Energy Materials, 2022, 5(3):3436-3446 DOI:10.1021/acsaem.1c04017 (SCI：000813049200001，JCR:Q1, Impact Factor: 6.959, 5-Year Impact Factor: 7.01，封面文章）

  9. Boyang Xun,Wenchao Tian, Qian Xun, Guoguang Zhang, Yixi Chen,Longji Pang, Thermal Resistance Analysis of Power MOSFETs using Creo/Ansys Software Versus Physical Measurements, 2022 IEEE 13th International Symposium on Power Electronics for Distributed Generation Systems(PEDG), 2022.6, Kiel, Germany，DOI：10.1109/PEDG54999.2022.9923245，（SCI：000943515500020）

  10. Tian Wenchao, Li Zhao, Cheng Chunmin, Li Wenhua), Chen Zhiqiang, Xin Fei, Hydrogen Storage Performance of gamma-Graphdiyne Doped Li Based on First Principles for Micro/Nano, Micromachines, 2022, 13(4), DOI:10.3390/mi13040547, (SCI: 000786130100001, JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  11. Zheng Zhuoyue, Wang Yongkun, Han Lei, Wu Daowei, Tian Wenchao，A Method for Broadband Polyimide Permittivity Measurement of Silicon Interposer Applied for High Speed Digital Microsystem，Micromachines, 13(7), 1138, 2022,DOI:10.3390/mi13071138, (SCI: 000831683500001, JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  12. Xin Fei, Lyu Qiang, Tian Wenchao, Visualization and Heat Transfer Performance of Mini-Grooved Flat Heat Pipe Filled with Different Working Fluids, Micromachines, 13(8), DOI: 10.3390/mi13081341, (SCI: 000845386500001，JCR: Q2, Impact factor: 3.523, 5-year Impact: 3.462)

  13. Yuhe Duan, Haoyue Ji, Xiaodong Sun, Wenchao Tian, Hao Cui, Design of temperature control system for burn-in test based on fuzzy adaptive PID control algorithm, 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022, 8.9-11, Dalian, China

  14. Haoyue Ji, Yuhe Duan, Xiaodong Sun, Wenchao Tian, Hao Cui, Design and verification of modular and reusable aging test system for high power SIP, 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022, 8.9-11, Dalian, China

  15. Yanrong Cao, Min Wang, Xuefeng Zheng, Enxia Zhang, Ling Lv, Liang Wang, Maodan Ma, Hanghang Lv, Zhiheng Wang, Yongkun Wang, Wenchao Tian, Xiaohua Ma and Yue Hao，Combined Effect of TID Radiation and Electrical Stress on NMOSFETs，2022，2022，13(11)，1860，DOI:10.3390/mi13111860（SCI：000883936800001，JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  16. Xin Fei, Ma Ting, Wang Qiuwang, Yan Yuying, Tian Wenchao, Thermal characterization and wick optimization of mini-grooved flat heat pipe for electronics cooling，Journal of  Thermal Analysis and Calorimetry, 2022, 11, DOI:10.1007/s10973-022-11739-0 (SCI：000883230600002，JCR: Q1, Impact factor:4.755, 5-year Impact: 3.641)

  17. Chen Zhiqiang，Cao Yunqi，He Yuxiao，Tian Wenchao，A thermally activated VO2-based attenuator with SRR structure，Materials and Design，2022, 23(JCR:Q1,Impact factor:9.856)

2021：

  1. Wenchao Tian, Jiahao Niu, Wenhua Li, Xiaohan Liu, Study on adsorption of CO and CO2 by graphene gas sensor, Modern Physics Letters B, 2021, 35(9), DOI:10.1143/so217984921501542, (SCI:000636279000003,JCR:Q4，Impact factor: 1.668, 5-Year Impact:1.138）

  2. Zhongliang Xie, Nawei Shen, Weidong Zhu, Wenchao Tian, Liang Hao, Theoretical and experimental investigation on the influences of misalignment on the lubrication performances and lubrication regimes transition of water lubricated bearing.  Mechanical Systems and Signal Processing. 2021, 14(9), DOI:10.1016/j.ymssp.2020.107211,(SCI:000587904100005, JCR:Q1, Impact factor: 6.823,5-Year Impact:6.662)

  3. Tian Wenchao, Hou Xuewei, Cui Hao, Feng Xuegui, A method of research about the reliaility of solder joint shapes, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021.8, 11-14, xiamen, China

  4. Wenchao Tian，Yiming Zhang，Yong Chen，Si Chen，Hao Cui，Simulation Research on Electromigration of BGA Devices，2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021.8, 11-14, xiamen, China

  5. jing shi,Xiao Liu, Fangyuan Zhu, Wencho Tian, Yuanhua Xia, Tangyuan Li, Rongrong Rao, Tao Zhang, Laijun Liu,Oxygen vacancy migration and its lattice structural origin in A-site non-stoichiometric bismuth sodium titanate perovskites, Journal of Materiomics,  2021,DOI:10.1016.j.jmat （JCR:Q1, Impact 6.425, 5-Year Impact Factor：8.409）

  6. 田文超，史以凡，陈思，袁风江，雒继军，陶瓷柱栅阵列封装器件回流焊工艺仿真，电子与封装，2021.11，110101-4（封面文章）

  7. 田文超，刘美君，辛菲，张国光，陈逸睎，铜带缠绕型焊柱装联结构的植柱工艺参数优化，电子与封装，2021.12，120203-5

  8. Shi Jing，Zhao Yunxia，Dong Rizhuang，Tian Wenchao，Liu Xiao，Polarization enhancement in Fe doped BNT based relaxors using Bi compensation，Journal of Alloys and Compounds，2021.12, 889，161720-10，DOI：10.1016/j.jallcom.2021.161720（SCI：000706735300004，JCR:Q1, Impact 5.316, 5-Year Impact Factor：4.631）

  9. 田文超，李昭，程春敏，崔昊，基于微系统中微型储能器件的γ-石墨二炔储氢性能研究，第二届微系统与先进封装仿真大赛三等奖， 2021.11

  10. 徐瀚洋，田文超，液滴式MEMS倾角传感器的仿真研究，第二届微系统与先进封装仿真大赛三等奖， 2021.11

  11. 侯学伟，田文超，牛佳豪，王星，SiP封装焊点形态对焊点可靠性影响，第二届微系统与先进封装仿真大赛三等奖， 2021.11

 

2020:

 

  1. Wenchao Tian, Xing Wang, Jiahao Niu, Hao Cui,Chen Y , Zhang Y, Research status of wafer level packaging of RF MEMES switches, 2020 21st International Conference on Electronic Packaging Technology (ICEPT), Guangzhou, China, 2020,pp. 1-5, DOI: 10.1109/ICEPT50128.2020.9202925.

  2. Wenchao Tian, C. Wang, Z. Zhao, X. Feng and Z. Wen, "Temperature cycle reliability analysis and life prediction of plastic encapsulated power semiconductor devices," 2020 21st International Conference on Electronic Packaging Technology (ICEPT), Guangzhou, China, 2020, pp. 1-4, DOI: 10.1109/ICEPT50128.2020.9202942.

  3. Daowei Wu, Wenchao Tian,Chuqiao Wang, Ruixia Huo, Yongkun Wang, Research of Wafer Level Bonding Process Based on Cu-Sn Eutectic, Micromachines ,2020, 11(9), 789-13,  DOI: 10.3390/mi11090789 (SCI: 000581399400001, JCR Q3, Impact factor: 2.891, 5-Year factor: 2.943)

  4. Xie, Zhongliang, Song Pan, Hao Liang, Shen Nawei, Zhu Weidong, Liu Huanling, Jing, Yongkun, Tian Wenchao，Investigation on effects of Fluid-Structure-Interaction(FSI) on the lubrication performances of water lubricated bearing in primary circuit loop system of nuclear power plant,Annals of Nuclear Energy,2020,141(6),DOI:10.1016/j.anucene.2020.107355,(SCI:000526111300033,JCR:Q2, Impact factor:1.776, 5-Year Impact Factor:1.826）

  5. Wenchao Tian, Chunmin Cheng, Chuqiao Wang and Wenhua Li,Research Progress on Thermal Conductivity of Graphdiyne Nanoribbons and its Defects: A Review,Recent Patents on Nanotechnology, 2020, 6,DOI: 10.2174/1872210514666200611094435(SCI:000603582600003,JCR:Q4,Impact factor: 1.952,5-Year Impact Factor:2.152）

  6. WenChao Tian, ChuQiao Wang, ZhangHan Zhao, Hao Cui ，Structures and Materials of System in Package: A Review，Recent Patents on Mechanical Engineering（SCI, Impact factor: 0.701,5-Year Impact Factor:0.598）

  7. Yongkun Wang, Zhenhong Chen, Jiahao Niu, Yang Shi, Junjie Ye, Wenchao Tian, Electrically responsive shape memory composites using silver plated chopped carbon fiber, Frontiers in Chemistry，2020.8(5), DOI:10.3389/fchem.2020.00322（SCI:000536691900001,JCR:Q1，Impact factor:5.211，5-Year Impact Factor：5.385）

  8. Tian Wenchao, Shi Yifan, Cui Hao, Shi Jing,Research on Piezoelectric Energy Harvester Based on Coupled Oscillator Model for vehicle vibration utilizing a L-shaped cantilever beam, Smart Materials and Structures，2020.29（7）DOI: 10.1088/1361-665X/ab87e1(SCI:000539756300001,JCR:Q2,Impact factor:3.585,5-Year Impact Factor:3.893）

  9. Cui Hao,Tian Wenchao, Kang Yu, Wang Yongkun, Characteristics of a novel thermal-induced epoxy shape memory polymer for smart device applications,Materials Research Express，2020, 7:015706-015721 (SCI:000521085300001,JCR:Q3,Impact factor:1.62,5-Year Impact Factor: 1.618)

  10. Xie Zhongliang, Shen Nawei, Zhu Weidong, Liu Huanling, Shi Jing, Wang  Yongkun, Tian Wenchao, Dynamic characteristics analysis of the hydro-hybrid liquid Sodium lubricated bearing-rotor coupled system in the two-circuit main loop liquid sodium pump system, Annals of Nuclear Energy, 2020, 136: DOI: 10.1016/j.anucene. 2019.107059 (SCI: 000498274900044, JCR:Q2, Impact factor:1.776, 5-Year Impact Factor:1.826)

  11. Wang Yongkun,Zhang Yuting, Zhang Jinhua, Ye Junjue, Tian Wenchao,Shape recovery characteristics of shape memory cyanate ester/epoxy composite reinforced with calcium sulfate whisker, Pigment & Resin Technology, 2020, 8, DOI: 10.1108/PRT-09-2019-0087 (SCI:000509993900001,JCR:Q4, Impact factor:1.263, 5-Year Impact Factor:1.189)

  12. Wang Yongkun, Liangchao Wang ,Zhang Yuting, Junjie Ye, Yang Shi, Tian Wenchao, Evaluating the effect of carbon black-A short carbon fiber hybrid filler on the electro-activated shape memory cyanate ester/epoxy composites, Science of Advanced Materials, 2020, 12(5), 652-658 (SCI:000495071800005, JCR:Q4,Impact factor: 1.474, 5-Year Impact Factor: 0.908)

  13. Xie Zhongliang, Shen Nawei, Ge Jianding, Zhu Weidong, Song Pan, Liu Huanling, Hao Liang, Tian Wenchao, Analysis of the flow noises of the nuclear main pump caused by the high temperature liquid Sodium in the two-circuit main loop liquid Sodium pump system, Annals of Nuclear Energy, 2020, 145: 107550. (SCI:000540700300004,JCR:Q2, Impact factor: 1.776, 5-Year Impact Factor: 1.826)

  14. Tian Yi, Liu Chifeng, Huang Xinbo, Tian Wenchao, Cao Wen, Zhu Yongcan, Zhao Long, The propagation of  the Ion-Flow Near the AC Transmission Lines, IEEE ACCESS, 2020,8,146498-146509,DOI:10.1109/ACCESS.2020.3013298 (SCI: 000562293800001, JCR: Q1, Impact factor: 3.367, 5-Year Impact Factor: 3.671)

2019:      

 

  1. Wenchao Tian, Liangliang Wang, and Wenhao Li, Analysis of Highly Uniform Process of Wafer Gold Bump Electrodeposition, 11th International Conference of Micro-NanoTechnology, CSMNT2019, 11-14 Oct. 2019, Wuhan, China

  2. Wenchao Tian, Wenhua Li, and Xiaohan Liu, Study on Adsorption of CO and CO2 by Graphene Gas Sensor, 11th International Conference of Micro-NanoTechnology, CSMNT2019, 11-14 Oct. 2019, Wuhan, China

  3. Zhiqiang Chen, Yunqi Cao,  Wenchao Tian, and Yongkun Wang, Surface roughness analysis of Cu films deposited on Si substrates: A molecular dynamic analysis, Journal of Applied Physics, 2019, 126, 045303 (SCI: 000478840600020, JCR:Q2, Impact factor: 2.546, 5-Year Impact Factor: 2.389)

  4. Wenchao Tian, Liangchao Wang, Hao Cui, Yu Kang, Zhanghan Zhao, The effect of molding compound on reliability of electronic components, First International Symposium on Risk Analysis and Safety of Complex Structures and Components, 1‐2 Jul. 2019, Porto . Portugal

  5. Wenchao Tian, Yuting Zhang, Mengjuan Li, Zhongliang Xie and Wenhua Li, 5-Bit Spiral Distributed RF MEMS Phase Shifters, IEEE-NANO 2019, 22-26 Jul. 2019, Macau, China

  6.  Wenchao Tian,  Mengjuan Li, Jiahao Niu, Wenhua Li, and Jing Shi, The Research progress and comparisons between Lithium-ion battery and Sodium ion battery, IEEE-NANO 2019，22-26 Jul. 2019, Macau, China

  7.  Wenchao Tian, Hao Cui and Wenbo Yu, Analysis and Experimental Test of Electrical Characteristics on Bonding Wire, Electronics, 2019, 8(3), 8030365(SCI: 000465642600009, JCR:Q2, Impact Factor: 2.397, 5-Year Impact Factor: 2.408)

  8. Jing Shi, Liu Xiao, Wenchao Tian, Structure evolution and ferroelectric properties in stoichiometric Bi0.5+xNa0.5-xTi1-0.5xO3, Journal of Materials Science, 2019, 54(7), 5249-5255 (SCI: 000455544800004, JCR:Q2, Impact factor: 4.22, 5-Year Impact Factor: 3.69)

  9. 田毅,黄新波,田文超,曹雯, 交直流输电线路离子流场的时域混合有限元法,电机与控制学报,2019(10),85-94

  10. Tian Wenchao, Zhang Yuting, Li Mengjuan, Xie Zhongliang,Li Wenhua, 5-Bit Spiral Distributed RF MEMS Phase Shifter, IEEE International Conference on Nanotechnology, 94-98, 2019 IEEE 19TH INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO 2019), Macau, CHINA, JUL 22-26, 2019 （SCI:000703919400018）

  11. Tian Wenchao, Li Mengjuan, Niu Jiahao, Li Wenhua, Shi Jing, The Research progress and comparisons between Lithium-ion battery and Sodium ion battery, IEEE International Conference on Nanotechnology, 313-318, 2019 IEEE 19TH INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO 2019), Macau, CHINA, JUL 22-26, 2019 （SCI:000703919400056）

 

 2018: 

  1. Yongkun Wang, Tianran Ma, Wenchao Tian, Junjie Ye, Xing Wang and Xiangjun Jiang, Electroactive shape memory properties of graphene/epoxy-cyanate ester nanocomposites, Pigment & Resin Technology, 2018,47 (1) :72-78 (SCI: 000424986200009, JCR:Q4, Impact factor:1.263, 5-Year Impact Factor: 1.189)

  2. Wenchao Tian, Ping Li, Linxiao Yuan, Research and Analysis of MEMS Switches in Different Frequency Bands, Micromachines, 2018, 9(4), 185 (SCI: 000434880200047, JCR: Q2, Impact Factor: 2.891, 5-Year Impact Factor: 2.943)

  3. Wenchao Tian, Zongyu Ling, Wenbo Yu, Jing Shi, A Review of Piezoelectric Energy Harvester Research, Applied Sciences-Basel, 2018, 8(4), 645 (SCI: 000434996400172, JCR: Q3, Impact Factor: 2.679, 5-Year Impact Factor: 2.736)

  4. Jing Shi, Xiao Liu, Wenchao Tian, High energy-storage properties of Bi0.5Na0.5TiO3-BaTiO3-SrTi0.875Nb0.1O3 lead-free relaxor ferroelectrics, Journal of Materials Science & Technology, 2018,34(12), 2371 (SCI: 000443274500020, JCR: Q1, Impact Factor: 8.067, 5-Year Impact Factor: 6.841)

  5. Wenchao Tian, Xiaohan Liu, Wenbo Yu, Research Progress of Graphene Gas Sensor: A review, Applied Sciences-Basel, 2018, 8, 1118 (SCI: 000441814300108, JCR: Q3, Impact Factor: 2.679, 5-Year Impact Factor: 2.736)

  6. Wenchao Tian, Tianran Ma, Xiaohan Liu,  TSV Technology and High Energy Heavy Ions Radiation Impact Review, Electronics, 2018, 7(7), 112 (SCI: 000440211600013, JCR: Q2, Impact Factor: 2.397, 5-Year Impact Factor: 2.408) 

  7. Wenchao Tian, Wenbo Yu, Xiaohan Liu, Yongkun Wang and Jing Shi, A review of the characteristics, synthesis and thermodynamics of type-II Weyl semimetal WTe2, Materials, 2018, 11, 1185 (SCI: 000442117300136, JCR: Q2, Impact Factor: 3.623, 5-Year Impact Factor: 3.92)

  8. Wenchao Tian, Daowei Wu, Zhiqiang Chen, Yongkun Wang, Application of Genetic Algorithlm in M×N Reconfigurable Antenna Array Based on RF MEMS Switches, Modern Physics Letters B, 2018, 32(30) DOI:10.1142/S0217984918503657, (SCI:000448838000005,JCR:Q4, Impact Factor: 1.668, 5-Year Impact Factor:1.138)

 

2017:

  1. Wenchao Tian, Wenhua Li, Xiaohan Liu, Yongkun Wang, Molecular dynamics study on resonance properties of nano resonator based on graphene nanosheet with two types of vacancy defects, Applied Sciences-Basel, 2017, 7 (1): 79-1-9 (SCI: 000395485900077, JCR: Q3, Impact Factor: 2.679, 5-Year Impact Factor: 2.736)

  2. Wenchao Tian, Wenhua Li, Wenbo Yu and Xiaohan Liu, A review on lattice defects in graphene: types, generation, effects and regulation, Micromachines, 2017, 8(5), 163 (SCI:000404117900031, JCR: Q2, Impact Factor: 2.891, 5-Year Impact Factor: 2.943)

  3. Wenchao Tian, Wenbo Yu, Jing Shi and Yongkun Wang, The property, preparation and application of topological insulators: A review, Materials, 2017, 10(7), 814  (SCI: 000406683000131, JCR: Q2, Impact Factor: 3.623, 5-Year Impact Factor: 3.92)

  4. Wenchao Tian, Xiaotong Zhang, Zhiqiang Chen, Performance analysis of MEMS phase shifters based on RF MEMS switches: A review, Recent Patents on Mechanical Engineering, 2017, 10(2):126-139（EI：20173404074887，Impact Factor: 0.701, 5-Year Impact Factor: 0.598）

  5. Zhiqiang Chen, Wenchao Tian, Xiaotong Zhang, Effect of surface asperities on the capacitances of capacitive RF MEMS switches, Journal of Micromechanics and Microengineering, 2017, 27(3): 034002-1-10 (SCI: 000395708500001, JCR: Q2, Impact Factor: 1.881, 5-Year Impact Factor: 1.952)

  6. Yongkun Wang, Wenchao Tian, Xiaohan Liu and Junjie Ye, Thermal sensitive shape memory behavior of epoxy composites reinforced with silicon carbide whiskers, Applied Scinces-Basel, 2017, 7(1): 108-1-10 (SCI: 000395485900105, JCR: Q3, Impact Factor: 2.679, 5-Year Impact Factor: 2.736)

  7. Jing Shi, Wenchao Tian, Electric-field induce phase transition and fatigue behaviors of (Bi0.5+x/2Na0.5-x/2) 0.94Ba0.06Ti1-xFexO3 ferroelectric, Journal of the American Ceramic Society, 2017, 100(3): 1080-1090 (SCI: 000397503100029, JCR: Q1, Impact Factor: 3.784, 5-Year Impact Factor: 3.679)

  8. Yongkun Wang, Wenchao Tian, Guangming Zhu, Electro-induced shape memory nanocomposite containing conductive carbon nanotubes, Journal of Nanoscience and Nanotechnology, 2017, 17(6): 3973-3679 (SCI:000402483900004, JCR: Q3, Impact Factor: 1.338, 5-Year Impact Factor: 1.105)

  9. Zhiqiang Chen, Wenchao Tian, Xiaotong Zhang, Analysis of a novel double driving signal line and driving electrodes separated RF MEMS switch, Modern Physics Letters B, 2017, 31(11): 1750113-1-18 (SCI: 000399832300003, JCR: Q4, Impact Factor: 1.668, 5-Year Impact Factor: 1.138)

  10. Yi Tian, Xinbo Huang, Wenchao Tian, Yongcan Zhu, Long Zhao, Ye Zhang, Study on the hybrid ion-flow field of HVDC and HVAC transmission lines by the nodal discontinuous Galerkin time-domain method, IET Generation, Transmission & Distribution, 2017, 11(1): 209-217 (SCI: 000393751800022, JCR: Q2, Impact Factor: 2.995, 5-Year Impact Factor: 3.48)

  11. Zhiqiang Chen, Wenchao Tian, Xiaotong Zhang, Yongkun Wang, Effects of deposition parameters on surface roughness and consequent electromagnetic performances of capacitive RF MEMS switches: A review, Journal of Micromechanics and Microengineering, 2017, 27(11):113003-1-26 (SCI: 000413110700002, JCR: Q2, Impact Factor: 1.881, 5-Year Impact Factor: 1.952)

  12. Wenchao Tian, Zhanghan Zhao, Electrical performance simulation of 2.5D package, 2nd International Conference on Modelling, Simulation and Applied Mathmatics (MSAM 2017), 2017, March, 26-27, Bangkok, Thailand, vol. 132, pp. 5-7 (SCI:000417222100002)

   

   2016:

  1. Wenchao Tian, Zhiqiang Chen, Yanrong Cao, Analysis and test of a new MEMS micro-actuator, Microsystem Technologies, 2016, 22(5): 943-952 (SCI: 000374570300005, JCR: Q3, Impact Factor: 2.276, 5-Year Impact Factor: 1.927)

  2. Wenchao Tian, Xiangyang Zhang, Zhiqiang Chen, Haoyue Ji, A review of graphene on NEMS, Recent Patents on Nanotechnology, 2016, 10(1): 3-10 (SCI: 000373124800003, JCR: Q3, Impact Factor: 1.952, 5-Year Impact Factor: 2.152)

  3. Yongkun Wang, Wenchao Tian, Guangming Zhu, Jianqiang Xie, Thermomechanical and shape memory properties of SCF/SBS/LLDPE composites, Chinese Journal of Polymer Science, 2016, 34(11):1354-1362 (SCI: 000386709500006, JCR: Q2, Impact Factor: 3.603, 5-Year Impact Factor: 2.59)

  4. Yongkun Wang, Wenchao Tian, Jianqiang Xie, Yan Liu, Thermoelectric responsive shape memory graphene/hydro-epoxy composites for actuators, Micromachines, 2016, 7(8): 145-154 (SCI: 000382467700017, JCR: Q2, Impact Factor: 2.891, 5-Year Impact Factor: 2.943)

  5. Yongkun Wang, Junjie Ye, Wenchao Tian, Shape memory polymer composites of poly (styrene-b-butadiene-b-styrene) copolymer / liner low density polyethylene / Fe3O4 nanoparticles for remote activation, Applied Sciences, 2016, 3: 333-342 (SCI: 000389532800024, JCR: Q3, Impact Factor: 0.773, 5-Year Impact Factor: 1.232)

  6. Yi Tian, Xinbo Huang, Wenchao Tian, Hybrid method for calculation of ion-flow fields of HVDC transmission lines, IEEE Transactions on Dielectrics and Electrical Insulation, 2016, 23(5): 2830-2839 (SCI: 000389215000039, JCR: Q2, Impact Factor: 2.931, 5-Year Impact Factor: 2.866)

  7. Wenchao Tian, Haoyue Ji, Recent research of electromagnetic characteristics in wire bonding, Recent Patents on Mechanical Engineering, 2016, 9(2): 101-111 (EI: 20162402501958)

  8. Wenchao Tian, Qiang Chao, Jing Shi, Reconfigurable antennas based on RF MEMS switches, Recent Patents on Mechanical Engineering, 2016, 9(3): 230-240 (EI: 20163802813099)

  9. Wenchao Tian, Hao Cui, A simplification method of solder joints for thermal analysis in 3D packages, 17th International Conference on Electronic Packaging Technology, ICEPT, 16-19 Aug. 2016, Wuhan, China; Publisher: IEEE, Piscataway, NJ, USA, 812-815 (SCI: 000389835800177, EI: 20164502990900)

  10. Wenchao Tian, Hao Cui, A simplification method of TSV interposer for thermal analysis in 3D packages, 17th International Conference on Electronic Packaging Technology, ICEPT, 16-19 Aug. 2016, Wuhan, China; Publisher: IEEE, Piscataway, NJ, USA, 820-823 (SCI: 000389835800179, EI: 20164502990902)

  11. Wenchao Tian, Wenhua Li, Molecular dynamics study on vibrational properties of graphene nanoribbon resonator, Journal of Computational and Theoretical Nanoscience, 2016, 13(10): 7460-7466(Impact Factor: 1.666, 5-Year Impact Factor: 1.109)

 

    2015:

  1. Wenchao Tian, Zhiqiang Chen, Analysis of bistable inductive micro switch based on surface micro size effect, Applied Surface Science, 2015, 334: 32-39 (SCI: 000351609900007, JCR: Q1, Impact Factor: 6.707, 5-Year Impact Factor: 5.905)

  2. Wenchao Tian,  Sanjuan Wei. Current research status of microchannel thermal management technology, Recent Patents on Mechanical Engineering, 2015, 8: 1-12 (EI: 20153401206634)

  3. Wenchao Tian, Qiang Chao, Zhiqiang Chen, Failure mechanisms and reliability analysis of RF MEMS switches, Recent Patents on Mechanical Engineering, 2015, 8: 201-210 (EI: 20155101694062)

  4. Wenchao Tian, Haoyue Ji, Reliability analysis and thermal resistance degradation of high power chip under harsh  environment, 16th International Conference on Electronic Packaging Technology, ICEPT, 11-14 Aug. 2015, Changsha, China; Publisher: IEEE, Piscataway, NJ, USA, 1139-1144 (SCI:000380377000251, EI: 20160701931415)

  5. Wenchao Tian,  Sanjuan Wei, Reliability analysis of and experiment test on SAC305 solder balls, 16th International Conference on Electronic Packaging Technology, ICEPT, 11-14 Aug. 2015, Changsha, China; Publisher: IEEE, Piscataway, NJ, USA, 1134-1138 (SCI: 000380377000250, EI: 20164502990902)

  6. Wenchao Tian, Zhiqiang Chen, Analysis of a double-phase regulation and an ultra wideband tunable micro electromechanical system resonator, 2015 16th International Conference on Electronic Packaging Technology, ICEPT, 11-14 Aug. 2015, Changsha, China; Publisher: IEEE, Piscataway, NJ, USA, 1149-1153 (SCI: 000380377000253, EI: 20160701931344)

 

   2014:

  1. 田文超, 陈志强, 贾建援, 低压大位移静电微驱动器驱动机理分析, 西安电子科技大学学报, 2014, 41(2): 86 - 89 (EI: 20141817659861)

  2.  Wenchao Tian,    Jianglei Hu, High-power and high-reliability RF MEMS switch review, Recent Patents on Mechanical Engineering, 2014, 7(2): 105-112 (EI: 20143118006880)

  3. Tian Wenchao, Guan Rongcheng, Anti-vibration structure analysis and optimizing on BGA packaging module, 15th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP,12-15 Aug. 2014, Chengdu, China; Publisher: IEEE, Piscataway, NJ, USA, 524-528 (SCI: 000366592100120, EI: 20144400133929)

  4. Tian Wenchao, Guan Rongcheng,Effect and experiment of screw locations on BGA viscoplastic fatigue life, 15th International Conference on Electronic Packaging Technology (ICEPT), 12-15 Aug. 2014, Chengdu, China; Publisher: IEEE, Piscataway, NJ, USA, 529-534 (SCI: 000366592100121, EI: 20144400134023)

  5. 田文超, 陈志强, 山磊, 新型低电压大变形微驱动器数值求解及仿真, 计算物理, 2014, 31(2): 223-229

  6. 田文超, 陈志强, 新型双向加载MEMS微执行器动力学分析, 纳米技术与精密工程,2014, 12(5): 334-339

 

    2013:

  1. Tian Wenchao,  Yang Yintang, Molecular dynamics analysis of “stiction” based on multi-body EAM potential function, Journal of Computational and Theoretical Nanoscience, 2013, 10(4): 848-852(SCI:000320569600031,JCR:Q3, Impact Factor: 1.666, 5-Year Impact Factor: 1.109)

  2. Tian Wenchao, Jia Jianyuan, Dynamic analysis of bistable inductive micro-switch, Advanced Science Letters, 2013,19(6): 1686-1690

  3. Tian Wenchao,  Chen Zhiqiang, Modeling and micro scale analyzing of micro-switch applied in all-optical communication, Journal of Theoretical and Applied Information Technology, 2013, 48(1): 454-458

  4. Tian Wenchao,  Yang Liqin, Principle, characteristic and application of scanning probe microscope series, Recent Patents on Mechanical Engineering, 2013, 6(1): 48-57

 

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