Dr. Tian Wenchao

Professor of School of Electro-Mechanical Engineering, Xidian University

Master\\\\\'s supervisor, doctoral supervisor

Doctoral  enrollment Discipline: Mechatronic Engineering/080202, Instrument Science and Technology/080402

Master\\\\\'s enrollment Discipline: (academic degree) Mechanical Engineering/080200, Instrument Science and Technology/080400; (Professional Degree) Machinery/085500, Electronic Information/085400

Work Unit: School of Mechanical and Electrical Engineering, Department of Electronic Packaging 
State Key Laboratory of Electromechanical Integration Manufacturing  of High-Performance Electronic Equipment 　

Address: 

Xidian University, No.2 South Taibai Road, Xi\\\\\\\\\\\\'an,Shaanxi Province, China

Postcode: 710071

Email:wctian@xidian.edu.cn, 499422964@qq.com

Tel: +86-29-88202954

Office location: North Campus-Main Building-3 District-322

Founder and person in charge of the national specialty specialty of “Electronic Packaging Technology” (this specialty ranked first in the “2017 Chinese Science Evaluation Center” and “2017 Wuhan University China Education Quality Evaluation Center Chinese University Undergraduate Professional Rankings”, and It is the only first, not tied; Xidian University is the only school in the country that has a special national-level specialization in packaging), a key member of the State Key Laboratory of Electromechanical Integration Manufacturing  of High-Performance Electronic Equipment , and the first chief professor of ideological and Political education in the Electronic Packaging Technology major at Xidian Universitydeputy director of the Academic Committee of Xi’an Intelligent Instruments and Packaging Testing Key Laboratory, Advanced Packaging and Complex High-density Assembly Research Center Director, Deputy Chairman of the National Electronic Packaging Technology Textbook Writing Committee.Director of the "Key Frontier Technology Research Laboratory for Integrated Circuit Packaging and Testing" of Xi  Dian University - Guangdong Qipai, Director of the "Advanced Packaging and High-Density Assembly Testing Industry-University Integration Joint Laboratory" of Xi Dian University - Foshan Lanjian, Director of the "Joint Laboratory for High-Density Packaging and Testing Key Technologies of Xi Dian University - Shanghai Xuantian" Integrated Circuit, Director of the "DFM Joint Laboratory of Xi Dian University and Shanghai Wangyou", Director of the "Joint Research Center for Basic Research on Packaging and Sensor Chip Testing of Xi Dian University and Yangjie", Director of the "Joint Laboratory for Key Technologies of Sensor and Automotive Electronic Chip Packaging and Testing of Xi Dian University and Gongjin". Selected as one of the top 2% global top scientists in the annual scientific influence ranking in 2023.
 

Learning experience：

1. 1987.9-1991.7:  Bachelor degree of Electronic Equipment Structure in Xidian University

2. 1996.9-1999.6:  Master degree of Mechanical Manufacturing in Xidian University

3. 2000.9-2004.6:  Ph.D. degree of Mechanical Manufacturing and Automation in Xidian University

4. 2006.12-2007.12: Working as a guest professor in Institute of Microsystem (IMTEK), University of Freiburg, Germany

5. 2006.10-2008.10: Working in Microelectronics and Solid Electronics Post-doctoral working stations in Xidian University

Social work:

• Member of MEMS Standardization Committee of China

• Board member of the 2nd Council of Micro and Nano-meter SocietyChina

• Senior Member of the Chinese Society of Theoretical and Applied Mechanics (CSTAM)

• Senior Member of Chinese Mechanical Engineering Society

• Guest editor of "Recent Patents on Mechanical Engineering"and other international journals

• Evaluation expert of the National Science and Technology Award expert database

• Evaluation expert of the Natural Science Foundation of China (NSFC) expert database

• Evaluation expert of “863” Program

• Evaluation expert of International Scientific and Technological Cooperationexpert database

• Evaluation expert of the National Innovation Fundexpert database

• Evaluation expert of the National Postdoctoral Sustentation Fund expert database

• Evaluation expert of the National Doctoral Specialties Fund expert database

• Expert of the Expert Database of the Higher Education Research and Development Center of the Ministry of Education

• Evaluation experts of the Shaanxi Province Science and Technology Award Expert Database

• Evaluation experts of the Guangdong Province Science and Technology Award Expert Database

• Evaluation experts of the Shaanxi Province Maior Project Expert Database

• Evaluation experts of the Guangdong Province Maior Project Expert Database

• Evaluation experts of the Chongqing Province Maior Project Expert Database

• Evaluation experts of the Jiangxi Province Maior Project Expert Database

• Evaluation experts of the Shanxi Province Maior Project Expert Database

• Evaluation experts of the Anhui Province Maior Project Expert Database

• Evaluation experts of the Jiangsu Province Maior Project Expert Database

Secretary of the Electronic Packaging Department as the branch secretary, the founder and person in charge of the national specialty specialty of "Electronic Packaging Technology" (the major is listed in the "2017 Chinese Science Evaluation Center" and "2017 Wuhan University China Education Quality Evaluation Center Chinese University Undergraduate Rankings" ", Ranked first, and the only one, not tied; Xidian University is the only school in the country with a national specialty in packaging. 

Part-time job in the society: Deputy Chairman of the National Electronic Packaging Technology Textbook Compilation Committee (ranked first deputy director)

1. Advanced Electronic Packaging and High-density Microassembly Technologies: Thermal analysis, stress-strain analysis, electromagnetic analysis, high-speed signal integrity, power integrity, vibration and shock analysis, creep and stress relaxation analysis, failure and lifetime analysis, reliability analysis for integrated circuit semiconductor devices (discrete devices, high-power devices, silicon carbide, gallium nitride and other third-generation semiconductors) and high-density circuit modules (LTCC, HTCC and other multilayer boards); 3D stacking, wafer-level packaging, flip-chip bonding, fan-out technology, TSV technology, interposer technology, SIP technology, micro-systems and other advanced packaging and microassembly technologies.

2. MEMS Technology: Smart wearables, lidar, flexible manufacturing, design and simulation of micro-nano sensors and actuators, performance analysis and design of micro-light mechatronic systems, dynamic simulation and testing of micro-nano devices, analysis of emerging intelligent materials such as graphene (acetylene) sensors, processing and testing of smart wearable devices.

3. Photoelectric detection and electromechanical control: Reliability testing of electrical signals for high-speed signal integrity, power electronics, automotive electronics, 5G communication and other chips; collection of micro-optical mechanical electrical signals data and stress-strain detection; conversion and transmission of photoelectric information; design and processing of high-end special servo drive control technology; photoelectric sensing detection and system integration technology.