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Papers

Monographs： 

 

  1. Wenchao Tian, Huanling Liu, Daxing Zhang, Design for Electronic Package Structure, 2017, Xidian University Press 

  2. Wenchao Tian, Lifei Lou, Micro electro mechanical technology, 2014, Xidian University Press("Twelfth Five-Year" National Excellent Book Publishing Project, Supported by the Shaanxi Provincial Publishing Fund, Second Prize of Excellent Teaching Materials of Xidian University) 

  3. Wenchao Tian, Electronic packaging, MEMS and Microsystems, 2012, Xidian University Press ("Twelfth Five-Year" National Excellent Book Publishing Project)

  4. Wenchao Tian, Principle Design and analysis of MEMS, 2009, Xidian University Press

 

papers：

2023：

  1. Hao Cui, Wenchao Tian, Yiming Zhang，Zhiqiang Chen，The Study of the Reliability of Complex Components during the Electromigration Process，Micromachines, 2023, 14, 499 DOI:10.3390/mi14010104（JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  2. Tian Wenchao, Qian Yingying, Zhao Jingrong, Li Zhao, Li Bin, Research progress in microsystem packaging based on silicon carbide devices, Microelectronics and Computers，2023，40(1)，DOI：10.19304/J.ISSN1000-7180.2022.0717

  3. Shi Jing，Dong Rizhuang，He Jiayi，Wu, Daowei，Tian Wenchao，Liu Xiao，Regulating ferroelectric polarization and dielectric properties of BT-based lead-free ceramics，Journal of Alloys and Compounds，2023，933，DOI：10.1016/j.jallcom.2022.167746（SCI：000917433100004，JCR: Q1, Impact factor:6.371,5-Year Impact Factor:5.341）

  4. ZHANG Guoguang, TIAN Wenchao, LIU Meijun, Cong Junhao, CHEN Si, WANG Yongkun, Processing of copper strip wound CCGA for parameter optimization, electronics and packaging，2023，23（2）

2022:

  1. Chen Zhiqiang, Tian Wenchao Effect of Surface Roughness on the Electrical Performances of CPW Transmission Lines Used in Future Ultra-High Frequency Applications, Micromachines, 2022, 14(1), DOI:10.3390/mi14010104（SCI：000916267600001，JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  2. Ma Maodan, Cao Yanrong, Lv Hanghang, Wang Zhiheng, Zhang Xinxiang, Chen Chuan, Wu Linshan, Lv Ling, Zheng Xuefeng, Tian Wenchao, Ma Xiaohua, Hao Yue, Effect of Acceptor Traps in GaN Buffer Layer on Breakdown Performance of AlGaN/GaN HEMTs, Micromachines, 2022, 14(1), DOI: 10.3390/mi14010079（SCI：36677140，JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  3. Hao Cui, Wenchao Tian, Xutao Zhao, Shuai Chen, Zhiqiang Chen, Effect of the reflow process on IMC growth for different devices and complex components，Smart Materials and Structures，2022，31（11），DOI：10.1088/1361-665X/ac9ba9（SCI：000877319800001， JCR:Q2, Impact factor:4.143, 5-Year Impact Factor:3.938）

  4. Wenchao Tian, Bin Li, Zhao Li, Hao Cui, Jing Shi, Yongkun Wang,Jingrong Zhao， Using Chiplet encapsulation technology to achieve Processing-in-Memory functions，Micromachines, 2022，13(10)，1790，DOI:10.3390/mi13101790（SCI：000857604700001，JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  5. Wenchao Tian, Zhao Li, Yongkun Wang，Guoguang Zhang，Height Uniformity Simulation and Experimental Study of Electroplating Gold Bump for 2.5D/3D Integrated Packaging，Micromachines, 2022, 13(9), 1057， DOI:10.3390/mi13040547,（SCI:000857604700001, JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  6. Wenhua Li, Tian Wenchao，Molecular Dynamics Analysis of Graphene Nanoelectromechanical Resonators Based on Vacancy Defects，Nanomaterials，2022，12(10), 1722; DOI:10.3390/nano12101722 (SCI:000801755900001, JCR: Q1, Impact Factor:5.719, 5-Year Impact factor:5.81)

  7. Shi Jing, Rao Rongrong, Tian Wenchao, Xu Xiaomin, Liu, Xiao, Anomalous electrical performance of A-site double-bivalent-doped Bi0.49Na0.5TiO3-delta ceramics from nominal oxygen deficiency to excess, Ceramics International, 2022, 48:5210-5216, DOI: 10.1016/j.ceramint.2021.11.061 (SCI: 000743585100001,  JCR:Q1, Impact Factor: 4.527, 5-Year Impact factor: 4.049)

  8. Jing Shi, Yunxia Zhao, Jiayi He, Tangyuan Li, Fangyuan Zhu, Wenchao Tian, and Xiao Liu，Deferred polarization saturation boosting superior energy-storage efficiency and density simultaneously under moderate electric field in relaxor ferroelectrics, ACS Applied Energy Materials, 2022, 5(3):3436-3446 DOI:10.1021/acsaem.1c04017 (SCI：000813049200001，JCR:Q1, Impact Factor: 6.959, 5-Year Impact Factor: 7.01）

  9. Boyang Xun,Wenchao Tian, Qian Xun, Guoguang Zhang, Yixi Chen,Longji Pang, Thermal Resistance Analysis of Power MOSFETs using Creo/Ansys Software Versus Physical Measurements, 2022 IEEE 13th International Symposium on Power Electronics for Distributed Generation Systems(PEDG), 2022.6, Kiel, Germany

  10. Tian Wenchao, Li Zhao, Cheng Chunmin, Li Wenhua), Chen Zhiqiang, Xin Fei, Hydrogen Storage Performance of gamma-Graphdiyne Doped Li Based on First Principles for Micro/Nano, Micromachines, 2022, 13(4), DOI:10.3390/mi13040547, (SCI: 000786130100001, JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  11. Zheng Zhuoyue, Wang Yongkun, Han Lei, Wu Daowei, Tian Wenchao，A Method for Broadband Polyimide Permittivity Measurement of Silicon Interposer Applied for High Speed Digital Microsystem，Micromachines, 13(7), 1138, 2022,DOI:10.3390/mi13071138, (SCI: 000831683500001, JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  12. Xin Fei, Lyu Qiang, Tian Wenchao, Visualization and Heat Transfer Performance of Mini-Grooved Flat Heat Pipe Filled with Different Working Fluids, Micromachines, 13(8), DOI: 10.3390/mi13081341, (SCI: 000845386500001，JCR: Q2, Impact factor: 3.523, 5-year Impact: 3.462)

  13. Yuhe Duan, Haoyue Ji, Xiaodong Sun, Wenchao Tian, Hao Cui, Design of temperature control system for burn-in test based on fuzzy adaptive PID control algorithm, 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022, 8.9-11, Dalian, China

  14. Haoyue Ji, Yuhe Duan, Xiaodong Sun, Wenchao Tian, Hao Cui, Design and verification of modular and reusable aging test system for high power SIP, 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022, 8.9-11, Dalian, China

  15. Yanrong Cao, Min Wang, Xuefeng Zheng, Enxia Zhang, Ling Lv, Liang Wang, Maodan Ma, Hanghang Lv, Zhiheng Wang, Yongkun Wang, Wenchao Tian, Xiaohua Ma and Yue Hao，Combined Effect of TID Radiation and Electrical Stress on NMOSFETs，2022，2022，13(11)，1860，DOI:10.3390/mi13111860（SCI：000883936800001，JCR: Q2, Impact factor:3.523, 5-year Impact: 3.462)

  16. Xin Fei, Ma Ting, Wang Qiuwang, Yan Yuying, Tian Wenchao, Thermal characterization and wick optimization of mini-grooved flat heat pipe for electronics cooling，Journal of  Thermal Analysis and Calorimetry, 2022, 11, DOI:10.1007/s10973-022-11739-0 (SCI：000883230600002，JCR: Q1, Impact factor:4.755, 5-year Impact: 3.641)

  17. Chen Zhiqiang，Cao Yunqi，He Yuxiao，Tian Wenchao，A thermally activated VO2-based attenuator with SRR structure，Materials and Design，2022, 23(JCR:Q1,Impact factor:9.856)

2021：

  1. Wenchao Tian, Jiahao Niu, Wenhua Li, Xiaohan Liu, Study on adsorption of CO and CO2 by graphene gas sensor, Modern Physics Letters B, 2021, 35(9), DOI:10.1143/so217984921501542, (SCI:000636279000003,JCR:Q4，Impact factor: 1.668, 5-Year Impact:1.138）

  2. Zhongliang Xie, Nawei Shen, Weidong Zhu, Wenchao Tian, Liang Hao, Theoretical and experimental investigation on the influences of misalignment on the lubrication performances and lubrication regimes transition of water lubricated bearing.  Mechanical Systems and Signal Processing. 2021, 14(9), DOI:10.1016/j.ymssp.2020.107211,(SCI:000587904100005, JCR:Q1, Impact factor: 6.823,5-Year Impact:6.662)

  3. Tian Wenchao, Hou Xuewei, Cui Hao, Feng Xuegui, A method of research about the reliaility of solder joint shapes, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021.8, 11-14, xiamen, China

  4. Wenchao Tian，Yiming Zhang，Yong Chen，Si Chen，Hao Cui，Simulation Research on Electromigration of BGA Devices，2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021.8, 11-14, xiamen, China

  5. jing shi,Xiao Liu, Fangyuan Zhu, Wencho Tian, Yuanhua Xia, Tangyuan Li, Rongrong Rao, Tao Zhang, Laijun Liu,Oxygen vacancy migration and its lattice structural origin in A-site non-stoichiometric bismuth sodium titanate perovskites, Journal of Materiomics,  2021,DOI:10.1016.j.jmat （JCR:Q1, Impact 6.425, 5-Year Impact Factor：8.409）

  6. Tian Wenchao, Shi Yifan, Chen Si, Yuan Fengjiang, Luo Jijun, Reflow Soldering Process Simulation of Ceramic Column Grid Array Packaging Devices, Electronics and Packaging, 2021.11, 110101-4 (Cover article)

  7. TIAN Wenchao, LIU Meijun, XIN Fei, ZHANG Guoguang, CHEN Yijie, Optimization of column planting process parameters for copper strip winding welding column assembly structure, electronics and packaging，2021.12，120203-5

  8. Shi Jing，Zhao Yunxia，Dong Rizhuang，Tian Wenchao，Liu Xiao，Polarization enhancement in Fe doped BNT based relaxors using Bi compensation，Journal of Alloys and Compounds，2021.12, 889，161720-10，DOI：10.1016/j.jallcom.2021.161720（SCI：000706735300004，JCR:Q1, Impact 5.316, 5-Year Impact Factor：4.631）

  9. TIAN Wenchao, LI Zhao, CHENG Chunmin, CUI Hao, Research on hydrogen storage performance of γ-graphite diyne based on microsystem microsystem energy storage devices, Third Prize of the 2nd Microsystem and Advanced Packaging Simulation Competition， 2021.11

  10.  Xu Hanyang, Tian Wenchao, Simulation research of droplet MEMS inclination sensor, third prize of the 2nd Microsystem and Advanced Packaging Simulation Competition， 2021.11

  11. HOU Xuewei, TIAN Wenchao, NIU Jiahao, WANG Xing, The influence of SiP package solder joint morphology on the reliability of solder joint, the third prize of the 2nd Microsystem and Advanced Package Simulation Competition， 2021.11

 

2020:

 

  1. Wenchao Tian, Xing Wang, Jiahao Niu, Hao Cui,Chen Y , Zhang Y, Research status of wafer level packaging of RF MEMES switches, 2020 21st International Conference on Electronic Packaging Technology (ICEPT), Guangzhou, China, 2020,pp. 1-5, DOI: 10.1109/ICEPT50128.2020.9202925.

  2. Wenchao Tian, C. Wang, Z. Zhao, X. Feng and Z. Wen, "Temperature cycle reliability analysis and life prediction of plastic encapsulated power semiconductor devices," 2020 21st International Conference on Electronic Packaging Technology (ICEPT), Guangzhou, China, 2020, pp. 1-4, DOI: 10.1109/ICEPT50128.2020.9202942.

  3. Daowei Wu, Wenchao Tian,Chuqiao Wang, Ruixia Huo, Yongkun Wang, Research of Wafer Level Bonding Process Based on Cu-Sn Eutectic, Micromachines ,2020, 11(9), 789-13,  DOI: 10.3390/mi11090789 (SCI: 000581399400001, JCR Q3, Impact factor: 2.891, 5-Year factor: 2.943)

  4. Xie, Zhongliang, Song Pan, Hao Liang, Shen Nawei, Zhu Weidong, Liu Huanling, Jing, Yongkun, Tian Wenchao，Investigation on effects of Fluid-Structure-Interaction(FSI) on the lubrication performances of water lubricated bearing in primary circuit loop system of nuclear power plant,Annals of Nuclear Energy,2020,141(6),DOI:10.1016/j.anucene.2020.107355,(SCI:000526111300033,JCR:Q2, Impact factor:1.776, 5-Year Impact Factor:1.826）

  5. Wenchao Tian, Chunmin Cheng, Chuqiao Wang and Wenhua Li,Research Progress on Thermal Conductivity of Graphdiyne Nanoribbons and its Defects: A Review,Recent Patents on Nanotechnology, 2020, 6,DOI: 10.2174/1872210514666200611094435(SCI:000603582600003,JCR:Q4,Impact factor: 1.952,5-Year Impact Factor:2.152）

  6. WenChao Tian, ChuQiao Wang, ZhangHan Zhao, Hao Cui ，Structures and Materials of System in Package: A Review，Recent Patents on Mechanical Engineering（Accepted,Impact factor: 0.701,5-Year Impact Factor:0.598）

  7. Yongkun Wang, Zhenhong Chen, Jiahao Niu, Yang Shi, Junjie Ye, Wenchao Tian, Electrically responsive shape memory composites using silver plated chopped carbon fiber, Frontiers in Chemistry，2020.8(5), DOI:10.3389/fchem.2020.00322（SCI:000536691900001,JCR:Q1，Impact factor:5.211，5-Year Impact Factor：5.385）

  8. Tian Wenchao, Shi Yifan, Cui Hao, Shi Jing,Research on Piezoelectric Energy Harvester Based on Coupled Oscillator Model for vehicle vibration utilizing a L-shaped cantilever beam, Smart Materials and Structures，2020.29（7）DOI: 10.1088/1361-665X/ab87e1(SCI:000539756300001,JCR:Q2,Impact factor:3.585,5-Year Impact Factor:3.893）

  9. Cui Hao,Tian Wenchao, Kang Yu, Wang Yongkun, Characteristics of a novel thermal-induced epoxy shape memory polymer for smart device applications,Materials Research Express，2020, 7:015706-015721 (SCI:000521085300001,JCR:Q3,Impact factor:1.62,5-Year Impact Factor: 1.618)

  10. Xie Zhongliang, Shen Nawei, Zhu Weidong, Liu Huanling, Shi Jing, Wang  Yongkun, Tian Wenchao, Dynamic characteristics analysis of the hydro-hybrid liquid Sodium lubricated bearing-rotor coupled system in the two-circuit main loop liquid sodium pump system, Annals of Nuclear Energy, 2020, 136: DOI: 10.1016/j.anucene. 2019.107059 (SCI: 000498274900044, JCR:Q2, Impact factor:1.776, 5-Year Impact Factor:1.826)

  11. Wang Yongkun,Zhang Yuting, Zhang Jinhua, Ye Junjue, Tian Wenchao,Shape recovery characteristics of shape memory cyanate ester/epoxy composite reinforced with calcium sulfate whisker, Pigment & Resin Technology, 2020, 8, DOI: 10.1108/PRT-09-2019-0087 (SCI:000509993900001,JCR:Q4, Impact factor:1.263, 5-Year Impact Factor:1.189)

  12. Wang Yongkun, Liangchao Wang ,Zhang Yuting, Junjie Ye, Yang Shi, Tian Wenchao, Evaluating the effect of carbon black-A short carbon fiber hybrid filler on the electro-activated shape memory cyanate ester/epoxy composites, Science of Advanced Materials, 2020, 12(5), 652-658 (SCI:000495071800005, JCR:Q4,Impact factor: 1.474, 5-Year Impact Factor: 0.908)

  13. Xie Zhongliang, Shen Nawei, Ge Jianding, Zhu Weidong, Song Pan, Liu Huanling, Hao Liang, Tian Wenchao, Analysis of the flow noises of the nuclear main pump caused by the high temperature liquid Sodium in the two-circuit main loop liquid Sodium pump system, Annals of Nuclear Energy, 2020, 145: 107550. (SCI:000540700300004,JCR:Q2, Impact factor: 1.776, 5-Year Impact Factor: 1.826)

  14. Tian Yi, Liu Chifeng, Huang Xinbo, Tian Wenchao, Cao Wen, Zhu Yongcan, Zhao Long, The propagation of  the Ion-Flow Near the AC Transmission Lines, IEEE ACCESS, 2020,8,146498-146509,DOI:10.1109/ACCESS.2020.3013298 (SCI: 000562293800001, JCR: Q1, Impact factor: 3.367, 5-Year Impact Factor: 3.671)

2019:      

 

  1. Wenchao Tian, Liangliang Wang, and Wenhao Li, Analysis of Highly Uniform Process of Wafer Gold Bump Electrodeposition, 11th International Conference of Micro-NanoTechnology, CSMNT2019, 11-14 Oct. 2019, Wuhan, China

  2. Wenchao Tian, Wenhua Li, and Xiaohan Liu, Study on Adsorption of CO and CO2 by Graphene Gas Sensor, 11th International Conference of Micro-NanoTechnology, CSMNT2019, 11-14 Oct. 2019, Wuhan, China

  3. Zhiqiang Chen, Yunqi Cao,  Wenchao Tian, and Yongkun Wang, Surface roughness analysis of Cu films deposited on Si substrates: A molecular dynamic analysis, Journal of Applied Physics, 2019, 126, 045303 (SCI: 000478840600020, JCR:Q2, Impact factor: 2.546, 5-Year Impact Factor: 2.389)

  4. Wenchao Tian, Liangchao Wang, Hao Cui, Yu Kang, Zhanghan Zhao, The effect of molding compound on reliability of electronic components, First International Symposium on Risk Analysis and Safety of Complex Structures and Components, 1‐2 Jul. 2019, Porto . Portugal

  5. Wenchao Tian, Yuting Zhang, Mengjuan Li, Zhongliang Xie and Wenhua Li, 5-Bit Spiral Distributed RF MEMS Phase Shifters, IEEE-NANO 2019, 22-26 Jul. 2019, Macau, China

  6.  Wenchao Tian,  Mengjuan Li, Jiahao Niu, Wenhua Li, and Jing Shi, The Research progress and comparisons between Lithium-ion battery and Sodium ion battery, IEEE-NANO 2019，22-26 Jul. 2019, Macau, China

  7.  Wenchao Tian, Hao Cui and Wenbo Yu, Analysis and Experimental Test of Electrical Characteristics on Bonding Wire, Electronics, 2019, 8(3), 8030365(SCI: 000465642600009, JCR:Q2, Impact Factor: 2.397, 5-Year Impact Factor: 2.408)

  8. Jing Shi, Liu Xiao, Wenchao Tian, Structure evolution and ferroelectric properties in stoichiometric Bi0.5+xNa0.5-xTi1-0.5xO3, Journal of Materials Science, 2019, 54(7), 5249-5255 (SCI: 000455544800004, JCR:Q2, Impact factor: 4.22, 5-Year Impact Factor: 3.69)

  9. 田毅,黄新波,田文超,曹雯, 交直流输电线路离子流场的时域混合有限元法,电机与控制学报,2019(10),85-94

 

 2018: 

  1. Yongkun Wang, Tianran Ma, Wenchao Tian, Junjie Ye, Xing Wang and Xiangjun Jiang, Electroactive shape memory properties of graphene/epoxy-cyanate ester nanocomposites, Pigment & Resin Technology, 2018,47 (1) :72-78 (SCI: 000424986200009, JCR:Q4, Impact factor:1.263, 5-Year Impact Factor: 1.189)

  2. Wenchao Tian, Ping Li, Linxiao Yuan, Research and Analysis of MEMS Switches in Different Frequency Bands, Micromachines, 2018, 9(4), 185 (SCI: 000434880200047, JCR: Q2, Impact Factor: 2.891, 5-Year Impact Factor: 2.943)

  3. Wenchao Tian, Zongyu Ling, Wenbo Yu, Jing Shi, A Review of Piezoelectric Energy Harvester Research, Applied Sciences-Basel, 2018, 8(4), 645 (SCI: 000434996400172, JCR: Q3, Impact Factor: 2.679, 5-Year Impact Factor: 2.736)

  4. Jing Shi, Xiao Liu, Wenchao Tian, High energy-storage properties of Bi0.5Na0.5TiO3-BaTiO3-SrTi0.875Nb0.1O3 lead-free relaxor ferroelectrics, Journal of Materials Science & Technology, 2018,34(12), 2371 (SCI: 000443274500020, JCR: Q1, Impact Factor: 8.067, 5-Year Impact Factor: 6.841)

  5. Wenchao Tian, Xiaohan Liu, Wenbo Yu, Research Progress of Graphene Gas Sensor: A review, Applied Sciences-Basel, 2018, 8, 1118 (SCI: 000441814300108, JCR: Q3, Impact Factor: 2.679, 5-Year Impact Factor: 2.736)

  6. Wenchao Tian, Tianran Ma, Xiaohan Liu,  TSV Technology and High Energy Heavy Ions Radiation Impact Review, Electronics, 2018, 7(7), 112 (SCI: 000440211600013, JCR: Q2, Impact Factor: 2.397, 5-Year Impact Factor: 2.408) 

  7. Wenchao Tian, Wenbo Yu, Xiaohan Liu, Yongkun Wang and Jing Shi, A review of the characteristics, synthesis and thermodynamics of type-II Weyl semimetal WTe2, Materials, 2018, 11, 1185 (SCI: 000442117300136, JCR: Q2, Impact Factor: 3.623, 5-Year Impact Factor: 3.92)

  8. Wenchao Tian, Daowei Wu, Zhiqiang Chen, Yongkun Wang, Application of Genetic Algorithlm in M×N Reconfigurable Antenna Array Based on RF MEMS Switches, Modern Physics Letters B, 2018, 32(30) DOI:10.1142/S0217984918503657, (SCI:000448838000005,JCR:Q4, Impact Factor: 1.668, 5-Year Impact Factor:1.138)

 

2017:

  1. Wenchao Tian, Wenhua Li, Xiaohan Liu, Yongkun Wang, Molecular dynamics study on resonance properties of nano resonator based on graphene nanosheet with two types of vacancy defects, Applied Sciences-Basel, 2017, 7 (1): 79-1-9 (SCI: 000395485900077, JCR: Q3, Impact Factor: 2.679, 5-Year Impact Factor: 2.736)

  2. Wenchao Tian, Wenhua Li, Wenbo Yu and Xiaohan Liu, A review on lattice defects in graphene: types, generation, effects and regulation, Micromachines, 2017, 8(5), 163 (SCI:000404117900031, JCR: Q2, Impact Factor: 2.891, 5-Year Impact Factor: 2.943)

  3. Wenchao Tian, Wenbo Yu, Jing Shi and Yongkun Wang, The property, preparation and application of topological insulators: A review, Materials, 2017, 10(7), 814  (SCI: 000406683000131, JCR: Q2, Impact Factor: 3.623, 5-Year Impact Factor: 3.92)

  4. Wenchao Tian, Xiaotong Zhang, Zhiqiang Chen, Performance analysis of MEMS phase shifters based on RF MEMS switches: A review, Recent Patents on Mechanical Engineering, 2017, 10(2):126-139（EI：20173404074887，Impact Factor: 0.701, 5-Year Impact Factor: 0.598）

  5. Zhiqiang Chen, Wenchao Tian, Xiaotong Zhang, Effect of surface asperities on the capacitances of capacitive RF MEMS switches, Journal of Micromechanics and Microengineering, 2017, 27(3): 034002-1-10 (SCI: 000395708500001, JCR: Q2, Impact Factor: 1.881, 5-Year Impact Factor: 1.952)

  6. Yongkun Wang, Wenchao Tian, Xiaohan Liu and Junjie Ye, Thermal sensitive shape memory behavior of epoxy composites reinforced with silicon carbide whiskers, Applied Scinces-Basel, 2017, 7(1): 108-1-10 (SCI: 000395485900105, JCR: Q3, Impact Factor: 2.679, 5-Year Impact Factor: 2.736)

  7. Jing Shi, Wenchao Tian, Electric-field induce phase transition and fatigue behaviors of (Bi0.5+x/2Na0.5-x/2) 0.94Ba0.06Ti1-xFexO3 ferroelectric, Journal of the American Ceramic Society, 2017, 100(3): 1080-1090 (SCI: 000397503100029, JCR: Q1, Impact Factor: 3.784, 5-Year Impact Factor: 3.679)

  8. Yongkun Wang, Wenchao Tian, Guangming Zhu, Electro-induced shape memory nanocomposite containing conductive carbon nanotubes, Journal of Nanoscience and Nanotechnology, 2017, 17(6): 3973-3679 (SCI:000402483900004, JCR: Q3, Impact Factor: 1.338, 5-Year Impact Factor: 1.105)

  9. Zhiqiang Chen, Wenchao Tian, Xiaotong Zhang, Analysis of a novel double driving signal line and driving electrodes separated RF MEMS switch, Modern Physics Letters B, 2017, 31(11): 1750113-1-18 (SCI: 000399832300003, JCR: Q4, Impact Factor: 1.668, 5-Year Impact Factor: 1.138)

  10. Yi Tian, Xinbo Huang, Wenchao Tian, Yongcan Zhu, Long Zhao, Ye Zhang, Study on the hybrid ion-flow field of HVDC and HVAC transmission lines by the nodal discontinuous Galerkin time-domain method, IET Generation, Transmission & Distribution, 2017, 11(1): 209-217 (SCI: 000393751800022, JCR: Q2, Impact Factor: 2.995, 5-Year Impact Factor: 3.48)

  11. Zhiqiang Chen, Wenchao Tian, Xiaotong Zhang, Yongkun Wang, Effects of deposition parameters on surface roughness and consequent electromagnetic performances of capacitive RF MEMS switches: A review, Journal of Micromechanics and Microengineering, 2017, 27(11):113003-1-26 (SCI: 000413110700002, JCR: Q2, Impact Factor: 1.881, 5-Year Impact Factor: 1.952)

  12. Wenchao Tian, Zhanghan Zhao, Electrical performance simulation of 2.5D package, 2nd International Conference on Modelling, Simulation and Applied Mathmatics (MSAM 2017), 2017, March, 26-27, Bangkok, Thailand, vol. 132, pp. 5-7 (SCI:000417222100002)

   

   2016:

  1. Wenchao Tian, Zhiqiang Chen, Yanrong Cao, Analysis and test of a new MEMS micro-actuator, Microsystem Technologies, 2016, 22(5): 943-952 (SCI: 000374570300005, JCR: Q3, Impact Factor: 2.276, 5-Year Impact Factor: 1.927)

  2. Wenchao Tian, Xiangyang Zhang, Zhiqiang Chen, Haoyue Ji, A review of graphene on NEMS, Recent Patents on Nanotechnology, 2016, 10(1): 3-10 (SCI: 000373124800003, JCR: Q3, Impact Factor: 1.952, 5-Year Impact Factor: 2.152)

  3. Yongkun Wang, Wenchao Tian, Guangming Zhu, Jianqiang Xie, Thermomechanical and shape memory properties of SCF/SBS/LLDPE composites, Chinese Journal of Polymer Science, 2016, 34(11):1354-1362 (SCI: 000386709500006, JCR: Q2, Impact Factor: 3.603, 5-Year Impact Factor: 2.59)

  4. Yongkun Wang, Wenchao Tian, Jianqiang Xie, Yan Liu, Thermoelectric responsive shape memory graphene/hydro-epoxy composites for actuators, Micromachines, 2016, 7(8): 145-154 (SCI: 000382467700017, JCR: Q2, Impact Factor: 2.891, 5-Year Impact Factor: 2.943)

  5. Yongkun Wang, Junjie Ye, Wenchao Tian, Shape memory polymer composites of poly (styrene-b-butadiene-b-styrene) copolymer / liner low density polyethylene / Fe3O4 nanoparticles for remote activation, Applied Sciences, 2016, 3: 333-342 (SCI: 000389532800024, JCR: Q3, Impact Factor: 0.773, 5-Year Impact Factor: 1.232)

  6. Yi Tian, Xinbo Huang, Wenchao Tian, Hybrid method for calculation of ion-flow fields of HVDC transmission lines, IEEE Transactions on Dielectrics and Electrical Insulation, 2016, 23(5): 2830-2839 (SCI: 000389215000039, JCR: Q2, Impact Factor: 2.931, 5-Year Impact Factor: 2.866)

  7. Wenchao Tian, Haoyue Ji, Recent research of electromagnetic characteristics in wire bonding, Recent Patents on Mechanical Engineering, 2016, 9(2): 101-111 (EI: 20162402501958)

  8. Wenchao Tian, Qiang Chao, Jing Shi, Reconfigurable antennas based on RF MEMS switches, Recent Patents on Mechanical Engineering, 2016, 9(3): 230-240 (EI: 20163802813099)

  9. Wenchao Tian, Hao Cui, A simplification method of solder joints for thermal analysis in 3D packages, 17th International Conference on Electronic Packaging Technology, ICEPT, 16-19 Aug. 2016, Wuhan, China; Publisher: IEEE, Piscataway, NJ, USA, 812-815 (SCI: 000389835800177, EI: 20164502990900)

  10. Wenchao Tian, Hao Cui, A simplification method of TSV interposer for thermal analysis in 3D packages, 17th International Conference on Electronic Packaging Technology, ICEPT, 16-19 Aug. 2016, Wuhan, China; Publisher: IEEE, Piscataway, NJ, USA, 820-823 (SCI: 000389835800179, EI: 20164502990902)

  11. Wenchao Tian, Wenhua Li, Molecular dynamics study on vibrational properties of graphene nanoribbon resonator, Journal of Computational and Theoretical Nanoscience, 2016, 13(10): 7460-7466(Impact Factor: 1.666, 5-Year Impact Factor: 1.109)

 

    2015:

  1. Wenchao Tian, Zhiqiang Chen, Analysis of bistable inductive micro switch based on surface micro size effect, Applied Surface Science, 2015, 334: 32-39 (SCI: 000351609900007, JCR: Q1, Impact Factor: 6.707, 5-Year Impact Factor: 5.905)

  2. Wenchao Tian,  Sanjuan Wei. Current research status of microchannel thermal management technology, Recent Patents on Mechanical Engineering, 2015, 8: 1-12 (EI: 20153401206634)

  3. Wenchao Tian, Qiang Chao, Zhiqiang Chen, Failure mechanisms and reliability analysis of RF MEMS switches, Recent Patents on Mechanical Engineering, 2015, 8: 201-210 (EI: 20155101694062)

  4. Wenchao Tian, Haoyue Ji, Reliability analysis and thermal resistance degradation of high power chip under harsh  environment, 16th International Conference on Electronic Packaging Technology, ICEPT, 11-14 Aug. 2015, Changsha, China; Publisher: IEEE, Piscataway, NJ, USA, 1139-1144 (SCI:000380377000251, EI: 20160701931415)

  5. Wenchao Tian,  Sanjuan Wei, Reliability analysis of and experiment test on SAC305 solder balls, 16th International Conference on Electronic Packaging Technology, ICEPT, 11-14 Aug. 2015, Changsha, China; Publisher: IEEE, Piscataway, NJ, USA, 1134-1138 (SCI: 000380377000250, EI: 20164502990902)

  6. Wenchao Tian, Zhiqiang Chen, Analysis of a double-phase regulation and an ultra wideband tunable micro electromechanical system resonator, 2015 16th International Conference on Electronic Packaging Technology, ICEPT, 11-14 Aug. 2015, Changsha, China; Publisher: IEEE, Piscataway, NJ, USA, 1149-1153 (SCI: 000380377000253, EI: 20160701931344)

 

   2014:

  1. TIAN Wenchao, CHEN Zhiqiang, JIA Jianyuan, Analysis of driving mechanism of low-voltage large-displacement electrostatic microdrive, Journal of Xidian University 2014, 41(2): 86 - 89 (EI: 20141817659861)

  2.  Wenchao Tian,    Jianglei Hu, High-power and high-reliability RF MEMS switch review, Recent Patents on Mechanical Engineering, 2014, 7(2): 105-112 (EI: 20143118006880)

  3. Tian Wenchao, Guan Rongcheng, Anti-vibration structure analysis and optimizing on BGA packaging module, 15th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP,12-15 Aug. 2014, Chengdu, China; Publisher: IEEE, Piscataway, NJ, USA, 524-528 (SCI: 000366592100120, EI: 20144400133929)

  4. Tian Wenchao, Guan Rongcheng,Effect and experiment of screw locations on BGA viscoplastic fatigue life, 15th International Conference on Electronic Packaging Technology (ICEPT), 12-15 Aug. 2014, Chengdu, China; Publisher: IEEE, Piscataway, NJ, USA, 529-534 (SCI: 000366592100121, EI: 20144400134023)

  5. TIAN Wenchao, CHEN Zhiqiang, SHAN Lei, Numerical solution and simulation of new low-voltage and large-deformation microdrivers, Computational Physics,, 2014, 31(2): 223-229

  6. Tian Wenchao, Chen Zhiqiang, Kinetic analysis of novel bidirectional loading MEMS microactuators, Nanotechnology and precision engineering ,2014, 12(5): 334-339

 

    2013:

  1. Tian Wenchao,  Yang Yintang, Molecular dynamics analysis of “stiction” based on multi-body EAM potential function, Journal of Computational and Theoretical Nanoscience, 2013, 10(4): 848-852(SCI:000320569600031,JCR:Q3, Impact Factor: 1.666, 5-Year Impact Factor: 1.109)

  2. Tian Wenchao, Jia Jianyuan, Dynamic analysis of bistable inductive micro-switch, Advanced Science Letters, 2013,19(6): 1686-1690

  3. Tian Wenchao,  Chen Zhiqiang, Modeling and micro scale analyzing of micro-switch applied in all-optical communication, Journal of Theoretical and Applied Information Technology, 2013, 48(1): 454-458

  4. Tian Wenchao,  Yang Liqin, Principle, characteristic and application of scanning probe microscope series, Recent Patents on Mechanical Engineering, 2013, 6(1): 48-57

 

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