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  1. Guoliang Li1, Guangbao Shan, Baoping Meng. Intelligent Multifield Collaborative Optimization Method for TSV Array With Performance Constraints. IEEE Transactions on Electron Devices vol. 70, no. 9, pp. 4772-4778, Sept. 2023, doi: 10.1109/TED.2023.3296686.
  2. Y. Zheng, G. Shan, Z. Liu and Z. Yang, "A Reusable Interposer for Multi-Chiplet Microsystems Reconfiguration," 2023 IEEE MTT-S International Wireless Symposium (IWS), Qingdao, China, 2023, pp. 1-3, doi: 10.1109/IWS58240.2023.10222805.
  3. Shan, G.; Wu, X.; Li, G.; Xing, C.; Zhang, S.; Fu, Y. Thermodynamic Multi-Field Coupling Optimization of Microsystem Based on Artificial Intelligence. Micromachines 2023, 14, 411. https://doi.org/10.3390/mi14020411
  4. Meng, B.; Shan, G.; Zheng, Y. Design of Spectrum Processing Chiplet Based on FFT Algorithm. Micromachines 2023, 14, 402. https://doi.org/10.3390/mi14020402
  5. Shan, G.; Li, G.; Wang, Y.; Xing, C.; Zheng, Y.; Yang, Y. Application and Prospect of Artificial Intelligence Methods in Signal Integrity Prediction and Optimization of Microsystems. Micromachines 2023, 14, 344. https://doi.org/10.3390/mi14020344
  6. Baoping Meng, Guangbao Shan, Yanwen Zheng and Hao Xiang. Design of Spectrum Processing Chiplet-based on FFT Algorithm. SEIA' 2022, 21-23 September 2022, Corfu Holiday Palace, Corfu, Greece
  7. Guangbao Shan, Yanwen Zheng, Chaoyang Xing, etc. Architecture of Computing System based on Chiplet. Micromachines 2022, 1, 13, 205. https://doi.org/10.3390/mi13020205.
  8. 单光宝, 郑彦文, 章圣长. 射频微系统集成技术. 固体电子学研究与进展. 2021年06期 v.41 P 405-412. DOI: 10.19623/j.cnki.rpsse.2021.06.001.(约稿)
  9. Shan, G.; Li, G.; Chen, D.; Yang, Z.; Li, D.; Yang, Y. An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias. Micromachines 2021, 12, 1223. https://doi.org/ 10.3390/mi12101223
  10. Bowen Zhang, Guangbao Shan, Fei Su. Impact reliability analysis of a rigid-flex PCB system under acceleration loads.  Microelectronics Reliability. Volume 127, December 2021, 114374, doi.org/10.1016/j.microrel.2021.114374.
  11. Dongdong Chen , Linwei Wang, Xingjun Luo, Chunlong Fei, Di Li * , Guangbao Shan * and Yintang Yang. Recent Development and Perspectives of Optimization Design methods for piezoeletric ulrasonic trancdecers. Micromachines, June 2021, doi.org/10.3390/mi12070779.
  12.  Xiaopeng Wu; Mingpeng Cao; Guangbao Shan; Yintang Yang. A Fast Analysis Method of Multiphysics Coupling for 3-D Microsystem. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, September 2021, doi: 10.1109/TCAD.2021.3111545.  
  13. 曹明鹏,  吴晓鹏,  管宏山,  单光宝等. 基于对偶单元法的三维集成微系统电热耦合分析. 物理学报，   Vol. 70, No. 7 (2021)    074401DOI: 10.7498/aps.70.20201628.
  14. Shan Guangbao, Lu Qijun,  Liu Song, Yang Yintang. Through-Silicon Capacitor Interconnection for High Frequency 3-D Microsystem. IEEE Transactions on Components, Packaging and Manufacturing Technology, July 2019, pp.1310-1318. DOI: 10.1109/TCPMT.2018.2879977.
  15. Qijun Lu, Jianqin Deng, Guangbao Shan, Zhangming Zhu. Wideband compact power amplifier based on novel spatial power combining technique for millimeter-wave applications. Microw Opt Technol Lett. 2021;63:160–165. DOI: 10.1002/mop.32594.
  16. Lu Qijun, Zhu Zhangming, Shan Guangbao, etc.al. 3-D Compact 3 dB Branch-Line Directional Couplers Based on Through-Silicon Via Technology for Millimeter-Wave Applications. IEEE Transactions on Components, Packaging and Manufacturing Technology. DOI:10.1109/TCPMT. 2019.2927553.
  17. Guangbao Shan, Guodong Wang, Qijun Lu, Yintang Yang. A 3D heterogeneously integrated guidance, navigation, and control micro-system. Japanese Journal of Applied Physics 58, SHCB01 (2019). Doi:10.7567/1347-4065/ab17c3.
  18. Liu Song, Shan Guangbao. An anisotropic thermal-stress model for through-silicon via. Journal of Semiconductors 2018 Vol.39 No.2 P026003  1674-4926[5]
  19. Guangbao Shan. High reliable 3D Integration Micro-system for aerospace applications. Light Conference 2017. 17-18 July， 2017， Changchun， China. (Invited paper)
  20. Yi, Lei, Shan, Guangbao, Liu, Song, Xie Chengmin. High-performance processor design based on 3D on-chip cache. Microprocessors and Microsystems 2016 Vol.47 Part B P486-490 0141-9331
  21. Lei Yi, Guangbao Shan*, Song Liu, Chengmin Xie. A new processor design based on 3D cache. International Conference on Process Automation, Control and Computing (PACC 2015)261-265
  22. Liu Song, Shan GuangBao*, Xie, ChengMin, Wulongsheng, Lei Yi. The modeling of DC current crowding for Through-silicon Via in 3-D IC. Electronic Packaging Technology (ICEPT), 2015 16th International Conference on, IEEE, (2015) 935-938
  23. He, Xin, Shan Guang-Bao*, Wu Long-Sheng, Sun Youmin, Du Xinrong. The development of 3D aerospace SRAM integration technology using silicon interposer. Electronic Packaging Technology (ICEPT), 2015 16th International Conference on, IEEE, (2015) Pages: 994-996
  24. Liu Song, Shan Guangbao*, Xie Chengmin, Du Xinrong.  A Transimission line-type electrical model for tapered TSV considering MOS effect and frequency-dependent behavior. Journal of Semconductors Volume: Vol. 36 No. 2  (2015): 024009
  25. Wu, Daowei, Li, Ke Zhong, Shan, GuangBao*, Zheng XiaoQiong, Jin Yu-Feng. Opening the hole of the backside silicon and forming the alloy bump for TSVs. Electronic Packaging Technology (ICEPT), 2015 16th International Conference on, IEEE, (2015) 969-971
  26. Liu Song, Shan Guangbao*, Xie Chengmin, Du Xinrong.  A Transimission line-type electrical model for tapered TSV considering MOS effect and frequency-dependent behavior. Journal of Semconductors Volume: Vol. 36 No. 2  (2015): 024009
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