Papers
- Guangbao Shan, Yanwen Zheng, Chaoyang Xing, etc. Architecture of Computing System based on Chiplet. Micromachines 2022, 1, 13, 205. https://doi.org/10.3390/mi13020205.
- Guangbao Shan, Yanwen Zheng, Shengchang Zhang. RF Microsystem Integration Technology. Research & Progress of SSE. Vol.41, 405-412, No.6 Dec, 2021. DOI: 10.19623/j.cnki.rpsse.2021.06.001.(Invited paper)
- Shan, G.; Li, G.; Chen, D.; Yang, Z.; Li, D.; Yang, Y. An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias. Micromachines 2021, 12, 1223. https://doi.org/ 10.3390/mi12101223
- Bowen Zhang, Guangbao Shan, Fei Su. Impact reliability analysis of a rigid-flex PCB system under acceleration loads. Microelectronics Reliability. Volume 127, December 2021, 114374, doi.org/10.1016/j.microrel.2021.114374.
- Dongdong Chen , Linwei Wang, Xingjun Luo, Chunlong Fei, Di Li * , Guangbao Shan * and Yintang Yang. Recent Development and Perspectives of Optimization Design methods for piezoeletric ulrasonic trancdecers. Micromachines, June 2021, doi.org/10.3390/mi12070779.
- Xiaopeng Wu; Mingpeng Cao; Guangbao Shan; Yintang Yang. A Fast Analysis Method of Multiphysics Coupling for 3-D Microsystem. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, September 2021, doi: 10.1109/TCAD.2021.3111545.
- Cao Ming -Peng， Wu Xiao -Peng， Guan Hong -Shan, Shan Guang -Bao etc. Electrothermal coupling analysis of three-dimensional integrated microsystem based on dual cell method. Acta Phys. Sin Vol. 70, No. 7 (2021) 074401, DOI: 10.7498/aps.70.20201628.
- Shan Guangbao, Lu Qijun, Liu Song, Yang Yintang. Through-Silicon Capacitor Interconnection for High Frequency 3-D Microsystem. IEEE Transactions on Components, Packaging and Manufacturing Technology, July 2019, pp.1310-1318. DOI: 10.1109/TCPMT.2018.2879977.
- Qijun Lu, Jianqin Deng, Guangbao Shan, Zhangming Zhu. Wideband compact power amplifier based on novel spatial power combining technique for millimeter-wave applications. Microw Opt Technol Lett. 2021;63:160–165. DOI: 10.1002/mop.32594.
- Lu Qijun, Zhu Zhangming, Shan Guangbao, etc.al. 3-D Compact 3 dB Branch-Line Directional Couplers Based on Through-Silicon Via Technology for Millimeter-Wave Applications. IEEE Transactions on Components, Packaging and Manufacturing Technology. DOI:10.1109/TCPMT. 2019.2927553.
- Guangbao Shan, Guodong Wang, Qijun Lu, Yintang Yang. A 3D heterogeneously integrated guidance, navigation, and control micro-system. Japanese Journal of Applied Physics 58, SHCB01 (2019). Doi:10.7567/1347-4065/ab17c3.
- Liu Song, Shan Guangbao*. An anisotropic thermal-stress model for through-silicon via. Journal of Semiconductors 2018 Vol.39 No.2 P026003 1674-4926
- Guangbao Shan. High reliable 3D Integration Micro-system for aerospace applications. Light Conference 2017. 17-18 July， 2017， Changchun， China. (Invited paper)
- Yi, Lei, Shan, Guangbao, Liu, Song, Xie Chengmin. High-performance processor design based on 3D on-chip cache. Microprocessors and Microsystems 2016 Vol.47 Part B P486-490 0141-9331
- Lei Yi, Guangbao Shan*, Song Liu, Chengmin Xie. A new processor design based on 3D cache. International Conference on Process Automation, Control and Computing (PACC 2015)261-265
- Liu Song, Shan GuangBao*, Xie, ChengMin, Wulongsheng, Lei Yi. The modeling of DC current crowding for Through-silicon Via in 3-D IC. Electronic Packaging Technology (ICEPT), 2015 16th International Conference on, IEEE, (2015) 935-938
- He, Xin, Shan Guang-Bao*, Wu Long-Sheng, Sun Youmin, Du Xinrong. The development of 3D aerospace SRAM integration technology using silicon interposer. Electronic Packaging Technology (ICEPT), 2015 16th International Conference on, IEEE, (2015) Pages: 994-996
- Liu Song, Shan Guangbao*, Xie Chengmin, Du Xinrong. A Transimission line-type electrical model for tapered TSV considering MOS effect and frequency-dependent behavior. Journal of Semconductors Volume: Vol. 36 No. 2 (2015): 024009
- Wu, Daowei, Li, Ke Zhong, Shan, GuangBao*, Zheng XiaoQiong, Jin Yu-Feng. Opening the hole of the backside silicon and forming the alloy bump for TSVs. Electronic Packaging Technology (ICEPT), 2015 16th International Conference on, IEEE, (2015) 969-971
- Liu Song, Shan Guangbao*, Xie Chengmin, Du Xinrong. A Transimission line-type electrical model for tapered TSV considering MOS effect and frequency-dependent behavior. Journal of Semconductors Volume: Vol. 36 No. 2 (2015): 024009