专著：

• 田文超，陈志强，杨宇军，辛菲，电子封装、微机电与微系统（第2版），西安电子科技大学出版社，2022.11.

文章：

• Fei Xin, Qiuwang Wang, Yuying Yan, Wenchao Tian. Experimental investigation on the active thermal management of grooved flat heat pipe under the electrohydrodynamic effect. International Communications in Heat and Mass Transfer, 2023, 141, 106604. DOI: 10.1016/j.icheatmasstransfer.2022.106604 (JCR: Q1, Impact factor: 6.782, 5-Year Impact Factor: 6.39)
• Fei Xin, Qiang Lyu. A review on thermal properties of hydrogels for electronic devices applications. Gels, 2023, 9(1): 7(1-31). DOI: 10.3390/gels9010007 (JCR: Q1, Impact factor: 4.432, 5-Year Impact Factor: 5.523)
• Fei Xin, Qiang Lyu, Qiuwang Wang. Three-dimensional numerical analysis of mini-grooved flat heat pipe filled with different working fluids with experimental validation. Heat Transfer Engineering, 2023, 44(4): 317-333. DOI: 10.1080/01457632.2022.2059215 (JCR: Q3, Impact factor: 2.431, 5-Year Impact Factor: 2.149)
• Wenchao Tian, Shuaiqi Zhang, Wenbin Li, Yuanming Chen, Jingrong Zhao, Fei Xin, Yingying Qian, Wenhua Li. Study on cavitation, warpage deformation, and moisture diffusion of sop-8 devices during molding process. Micromachines, 2023, 14(12), 2175(1-15). DOI: 10.3390/mi14122175 (JCR: Q2, Impact factor: 3.523, 5-year Impact: 3.462)
• Fei Xin, Qiang Lyu, Wenchao Tian. Visualization and heat transfer performance of mini-grooved flat heat pipe filled with different working fluids. Micromachines, 2022, 13(8): 1341(1-16). DOI: 10.3390/mi13081341 (JCR: Q2, Impact factor: 3.523, 5-year Impact: 3.462)
• Fei Xin, Ting Ma, Qiuwang Wang, Yuying Yan, Wenchao Tian. Thermal characterization and wick optimization of mini-grooved flat heat pipe for electronics cooling. Journal of Thermal Analysis and Calorimetry, 2022, 147(24): 14859-14872. DOI: 10.1007/s10973-022-11739-0 (JCR: Q1, Impact factor: 4.755, 5-year Impact: 3.641)
• Wenchao Tian, Zhao Li, Chunmin Cheng, Wenhua Li, Zhiqiang Chen, Fei Xin. Hydrogen storage performance of gamma-graphdiyne doped Li based on first principles for micro/nano. Micromachines, 2022, 13(4): 547(1-12). DOI:10.3390/mi13040547 (JCR: Q2, Impact factor: 3.523, 5-year Impact: 3.462)
• Fei Xin, Ting Ma, Yuying Yan, Qiuwang Wang. Electrohydrodynamic mini flat heat pipe for advanced electronics cooling. Interfaclal Phenomena and Heat Transfer, 2021, 9: 43-59. DOI: 10.1615/InterfacPhenomHeatTransfer.2021035300
• Fei Xin, Ting Ma, Yitung Chen, Qiuwang Wang. Study on chemical spray etching of stainless steel for printed circuit heat exchanger channels. Nuclear Engineering and Design, 2019, 341: 91-99. DOI: 10.1016/j.nucengdes.2018.10.022 (JCR: Q2, Impact factor: 1.9, 5-year Impact: 1.972)
• Fei Xin, Ting Ma, Qiuwang Wang. Thermal performance analysis of flat heat pipe with graded mini-grooves wick. Applied Energy, 2018, 228: 2129-2139. DOI: 10.1016/j.apenergy.2018.07.053 (JCR: Q1, Impact factor: 11.446, 5-year Impact: 11.268)
• Fei Xin, Ting Ma, Yitung Chen, Qiuwang Wang. Two-dimensional chemical etching process simulation for printed circuit heat exchanger channels based on cellular automata model. Heat Transfer Engineering, 2017, 39(8): 617-629. DOI: 10.1080/01457632.2017.1325660 (JCR: Q3, Impact factor: 2.431, 5-Year Impact Factor: 2.149)
• Fei Xin, Ting Ma, Qiuwang Wang. Theoretical analysis of flat heat pipe with graded-porosity wick design. Energy Procedia, 2017, 142: 3932-3938. 
• Fei Xin, Ting Ma, Qiuwang Wang. Spray etching rate development of stainless steel in the etchant for printed circuit heat exchanger channels. Energy Procedia, 2017, 105: 4828-4835. 
• Ting Ma, Fei Xin, Lei Li, Xiangyang Xu, Yitung Chen, Qiuwang Wang. Effect of fin-endwall fillet on thermal hydraulic performance of airfoil printed circuit heat exchanger. Applied Thermal Engineering, 2015, 89: 1087-1095. DOI: 10.1016/j.applthermaleng.2015.04.022 (JCR: Q1, Impact factor: 6.465, 5-Year Impact Factor: 5.906)
• 田文超, 史以凡, 辛菲, 陈思, 袁风江, 雒继军. 陶瓷柱栅阵列封装器件回流焊工艺仿真, 电子与封装, 2021.11: 110101-4.（封面文章）
• 田文超, 刘美君, 辛菲, 张国光, 陈逸睎. 铜带缠绕型焊柱装联结构的植柱工艺参数优化, 电子与封装, 2021.12: 120203-5.
• 辛菲, 第二学位专业班主任育人模式实践研究. 世纪之星, 2021, 33: 13-15.
• 辛菲, 马挺, 王秋旺. 主动式电流体微槽平板热管的理论分析. 工程热物理学报, 2019, 40(5): 1120-1125. 
• 辛菲, 马挺, 王秋旺. 印刷电路板换热器换热槽道的喷淋蚀刻实验. 工程热物理学报, 2017, 38(12): 2674-2678.
• 辛菲, 李磊, 王秋旺. 流体微通道浸泡蚀刻技术实验. 化工学报, 2015, 66(10):4115-4122.