[1] H. Wei et al., "A Hybrid-Package 3-D GaN Power Module with Optimal Thermal Performance and High-Density Integration," in IEEE Transactions on Power Electronics, doi: 10.1109/TPEL.2026.3700125.

[2] L. Yu et al., "Novel PCB-Embedded Inductor Structure for Resonant Switched-Capacitor Converters," in IEEE Transactions on Industrial Electronics, doi: 10.1109/TIE.2026.3672841.

[3]W. Han et al., "Design and Optimization of Fractional-Turn Transformer With Low Core Loss and Profile," in IEEE Transactions on Industrial Electronics, vol. 73, no. 6, pp. 8691-8702, June 2026, doi: 10.1109/TIE.2026.3651350.

[4]L. Yu et al., "Symmetrical GaN-Based Vertical Module With Low Interference Integration and High Thermal Performance for PoL Converters," in IEEE Transactions on Industrial Electronics, vol. 72, no. 12, pp. 13164-13175, Dec. 2025, doi: 10.1109/TIE.2025.3577322.

[5]
[6]
[7];
[8]
[9]