学术信息网 西电导航 关于 使用说明 搜索 系统首页 登录 控制面板 收藏 刘晓贤的留言板
学术论文

[1] Liu Xiaoxian#Zhu Zhangming*Liu Yang, Lu Qijun, Yin Xiangkun, Yang Yintang, Wideband substrate integrated waveguide bandpass filter based on 3-D ICsIEEE Trans. on Components, Packaging and Manufacturing Technology2019, 9 (4): 728-735
[2] Liu Xiaoxian#Zhu Zhangming*Yang YintangDing RuixueLi Yuejin, Electrical modeling and analysis of differential dielectric-cavity through-silicon vias arrayIEEE Microwave and Wireless Components Letters201727 (7): 618~620
[3] Liu Xiaoxian#Zhu Zhangming*Yang YintangDing RuixueLow-loss air-cavity through-silicon vias (TSVs) for high speed three-dimensional integrated circuits (3D ICs)IEEE Microwave and Wireless Components Letters201626(2): 89~91
[4] Liu Xiaoxian#Zhu Zhangming*Yang YintangDing RuixueA Model of Air-Gap Through-Silicon Vias (TSVs) for Microwave ApplicationsIEEE Microwave and Wireless Components Letters201525(8): 493~495
[5] Liu Xiaoxian#Zhu Zhangming*Yang YintangDing RuixueParasitic Inductance of Non-Uniform Through-Silicon Vias (TSVs) for Microwave ApplicationsIEEE Microwave and Wireless Components Letters201525(7): 424~426
[6] Liu Xiaoxian#Zhu Zhangming*Liu Yang, Lu Qijun, Yin Xiangkun, Yang Yintang, Electical models of through silicon vias and silicon-based devices for millimeter-wave applicationInternational Journal of RF And Microwave Computer-aided Engineering2018e21447: 1~12
[7] Xiaoxian Liu#, Zhangming Zhu*, Yintang Yang, Ruixue Ding, and Yuejin Li. Parasitic effects of air-gap through-silicon vias in high-speed three-dimensional integrated circuits. Chinese Phyiscs B., 2016, 25 (11): 118401
[8] Xiaoxian Liu#, Zhangming Zhu*, Yintang Yang, Fengjuan Wang, and Ruixue Ding. Reduction of signal reflection along through silicon via channel in high-speed three-dimensional integration circuit. Chinese Phyiscs B., 2014, 23 (3): 038401
[9] Xiaoxian Liu#, Zhangming Zhu*, Yintang Yang, Fengjuan Wang, and Ruixue Ding. Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits. IEICE Electronics Express, 2013, 10 (14): 1-6

[10] Xiaoxian Liu#, Zhangming Zhu*, Yintang Yang, Fengjuan Wang, and Ruixue Ding. Impedance matching for the reduction of signal reflection in high speed multilevel three-dimensional integrated chips. Journal of Semiconductors, 2014, 35 (1): 015008

[11] Yintang Yang, Xiaoxian Liu#, Zhangming Zhu*, and Ruixue Ding. Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs. IEICE Electronics Express, 2014, 11 (14): 1-5

[12] Liu Xiaoxian#Zhu Zhangming*Yang Yintang, Lu Qijun, Yin Xiangkun, Liu Yang, Electrical modeling and analysis of polymer-cavity through-silicon vias2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017, Hangzhou, China, 2017.12.14~2017.12.16

[13] Xiaoxian Liu#, Zhangming Zhu*, Yintang Yang, Fengjuan Wang, and Ruixue Ding. Reduction of signal reflection caused by TSV insertion in three-dimensional on-chip high speed interconnect lines. 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, 2013.8.11 ~2013.8.14

[14] Liu YangZhu Zhangming, Liu Xiaoxian*, Lixin Guo, Yintang Yang. Broadband inductance modeling of TXVs for 3D interconnection, Microelectronics Journal, 2019, 88: 56-60

[15] Qu ChenbingLiu YangLiu XiaoxianZhu Zhangming*,Inductance Modeling of Interconnections in 3-D Stacked-Chip Packaging,IEEE MicrowaveI and Wireless Components Letters,2018.28(4)

[16] Qu ChenbingDing RuixueLiu XiaoxianZhu Zhangming*,Modeling and Optimization of Multi-ground TSVs for Signals Shield in 3D ICs,IEEE Trans on Electromagnetic Compatibility,2017.59(2)

[17] Liao ChenguangZhu Zhangming*Lu QijunLiu XiaoxianWideband Electromagnetic Model and Analysis of Shielded-Pair Through-Silicon Vias,IEEE Trans on Components, Packaging, and Manufacturing Technology,2018.8(3)