代表性成果：

[1] Jian-Min Lu, Yu-Shan Li and Mu-Shui Zhang, “An efficient SPICE-compatible cavity resonant model for microstrip lines,” IEEE Tran. Compon. Packag. Manuf. Technol., vol. 1, no. 4, pp. 574-585, Apr. 2011. 

[2] Jian-Min Lu, Yu-Shan Li and Mu-Shui Zhang, “An efficient SPICE-compatible model for striplines including cavity resonant effect,” IEEE Trans. Electromagn. Compat., vol. 54, no. 4, pp. 815-825, Aug. 2012. 

指导博士生完成：

[1] Jun Wang, Jianmin Lu, Xiu-Qin Chu etc.. “Influence and mitigation of long differential via stub on signal integrity,” Electronics Letters, vol.51 , no.13, pp. 975-977 , Jun. 2015.

[2] Jun Wang, Jianmin Lu, Xiu-Qin Chu, “Modeling and Simulation of Planes With Decoupling Capacitors,” IEEE Tran. Compon. Packag. Manuf. Technol., vol. 6, no. 7, pp. 1087-1098, Jul. 2016.

[3] Jun Wang, Jianmin Lu, etc.. “Effective Radii of On-Chip Decoupling Capacitors Under Noise Constraint,” IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 24, no. 12, pp. 3415-3423, Dec. 2016.

[4] Jun Wang, Jianmin Lu, Yushan Li, “ Placement of Decoupling Capacitor on Packages Based on Effective Decoupling Radius,” in Proc. IEEE 18th Electronics Packaging Technology Conference, Singapore, pp. 195-198, Dec. 2016.