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学术论文

2014年以来发表第一作者及通信作者IEEE期刊论文40多篇。

 

IEEE TCAS-I  9篇; IEEE TCAS-II 7篇;IEEE TPE 2篇; IEEE TIE 1篇; IEEE Sensors  3篇;IEEE TVLSI 2篇;  IEEE TIM 1篇; IEEE TED 2篇; IEEE TMTT 1篇;IEEE MWCL 13篇;IEEE TCPMT 3篇;IEEE TEMC 2篇;IEEE TNANO 1篇。

 

IEEE Trans. on Circuits and Systems I: Regular Papers (IF=2.407)

TCAS-I-1) Zhangming Zhu*, Zheng Qiu, Maliang Liu, Ruixue Ding, A 6-to-10-Bit 0.5V-to-0.9V Reconfigurable 2MS/s power scalable SAR ADC in 0.18μm CMOS, IEEE Trans. on Circuits and Systems I: Regular Papers, 2015, Vol.62, no.3, pp.689-696

TCAS-I-2)  Zhangming Zhu*, Yuhua Liang. A 0.6-V 38-nW 9.4-ENOB 20-kS/s SAR ADC in 0.18um CMOS for Medical Implant Devices.IEEE Trans. on Circuits and Systems I: Regular Papers. 2015, vol.62, no.9, pp.2167-2176

TCAS-I-3)Zhangming Zhu*, Yongyun Li. A Floating Buck Controlled Multi-Mode Dimmable LED Driver Using a Stacked NMOS Switch. IEEE Trans. on Circuits and Systems I: Regular Papers. 2015, vol.62, no.10, pp.2584-2593

TCAS-I-4)Zhangming Zhu*, Jin Hu, Yutao Wang. A 0.45V, Nano-watt 0.033% Line Sensitivity MOSFET-only Sub-threshold Voltage Reference with no Amplifiers.IEEE Trans. on Circuits and Systems I: Regular Papers, 2016, vol.63, no.9, pp.1370-1380

TCAS-I-5)Shubin Liu, Yi Shen, Zhangming Zhu*, A 12-bit 10MS/s SAR ADC with High Linearity and Energy-Efficient Switching. IEEE Trans. on Circuits and Systems I: Regular Papers, 2016, vol.63, no.10, pp.1616-1627

TCAS-I-6)Zhangming Zhu*, Jingyu Wang. A Compact High-Performance Programmable-Gain Analog Front End for HomePlug AV2 Communication in 0.18 μm CMOS. IEEE Trans. on Circuits and Systems I: Regular Papers, 2017, vol.64, no.11, pp.2858-2870

TCAS-I-7)Yi Shen, Zhangming Zhu*, Shubin Liu and Yintang Yang. A Reconfigurable 10-to-12-Bit 80-to-20 MS/s Bandwidth Scalable SAR ADC. IEEE Trans. on Circuits and Systems I: Regular Papers, 2018,vol.65, no.1, pp.51-60

TCAS-I-8)Lianxi Liu*, Juncao Mu, Zhangming Zhu. A 0.55-V, 28-ppm/°C, 83-nW CMOS Sub-BGR With UltraLow Power Curvature Compensation. IEEE Trans. on Circuits and Systems I: Regular Papers, 2018,vol.65, no.1, pp.95-106

TCAS-I-9)Jingyu Wang, Shubin Liu, Yi Shen, Zhangming Zhu*. Low-Power Single-Ended SAR ADC Using Symmetrical DAC Switching for Image Sensors with Passive CDS and PGA Technique. IEEE Trans. on Circuits and Systems I: Regular Papers, 2018,vol.65. doi: 10.1109/TCSI.2018.2794465

 

IEEE Trans. on Power Electronics (IF=7.151)

TPE-1Zhangming Zhu*, Qiang Wu, Zeyu Wang. A Self-compensation OCP Control Scheme for Primary-side Controlled Flyback AC/DC Converters. IEEE Trans. on Power Electronics, 2017, Vol.32, no.5, pp.3673-3682

TPE-2)Qiang Wu, Zhangming Zhu*. An Adaptive High-precision OCP Control Scheme for Flyback AC/DC Converters. IEEE Trans. on Power Electronics, 2017, vol.32, no.12, pp.8969-8973

 

IEEE Trans. on Industrial Electronics (IF=7.168)

TIE-1) Qiang Wu, Zhangming Zhu*. A Versatile OCP Control Scheme for Discontinuous Conduction Mode Flayback AC/DC Converters. IEEE Trans. on Industrial Electronics, 2017, vol.64, no.8, pp.6443-6452

 

IEEE Trans. on Microwave Theory and Techniques IF=2.897

TMTT-1)Maliang Liu, Rui Ma, Shubin Liu, Zhen Ding, Pan Zhang, Zhangming Zhu*. A 5.0GHz Low-Power Low-Noise Integer-N Digital Sub-Sampling PLL with SAR-ADC PD.  IEEE Trans. on Microwave Theory and Techniques. 2018, accepted

 

IEEE Sensors Journal (IF=2.512)

SENSJ-1) Wenbin Bai, Zhangming Zhu*, Yani Li, Lianxi Liu. A 64.8µW >2.2GWDC-Coupled CMOS Front-End IC for Wearable ECG Monitoring. IEEE Sensors Journal, 2018, vol.18,no.8, pp.3400-3409

SENSJ-2)Hao Zheng,  Rui Ma, Maliang Liu,  Zhangming Zhu*. High Sensitivity and Wide Dynamic Range Analog Front-End Circuits for Pulsed TOF 4-D Imaging LADAR Receiver. IEEE Sensors Journal, 2018, vol.18, no.8, pp.3114-3124

SENSJ-3)Shubin Liu, Yi Shen, Jingyu Wang , Zhangming Zhu*. A 10-Bit Self-clocked SAR ADC with Enhanced Energy Efficiency for Multi-Sensor Applications. IEEE Sensors Journal, 2018, vol.18,no.10,  4223-4232

 

IEEE Trans. on Electron Devices (IF=2.605)

TED-1Fengjuan Wang, Zhangming Zhu*, Yintang Yang, Xiaoxian Liu, and Ruixue Ding.An Effective Approach of Reducing the Keep-Out-Zone (KOZ) Induced by Coaxial Through-Silicon-Via (TSV), IEEE Trans. on Electron Devices, 2014, Vol.61, No.8, pp.2928-2934

TED-2)Qijun Lu, Zhangming Zhu*, Yintang Yang and Ruixue Ding. Electrial Modeling and Characterization of Shield Differential Through-Silicon Vias, IEEE Trans. on Electron Devices, 2015, vol.62, no.5, pp. 1544-1552

 

IEEE Trans. on Instrumentation & Measurement (IF=2.456)

TIM-1)Hao Zheng, Rui Ma, Maliang Liu, Zhangming Zhu*. A Linear Dynamic Range Receiver with Timing Discrimination for Pulsed TOF Imaging LADAR Application. IEEE Trans. on Instrumentation & Measurement. 2018, doi: 10.1109/TIM.2018.2826860

 

IEEE Microwave and Wireless Components Letters ( IF=1.887)

MWCL-1Qijun Lu, Zhangming Zhu*, Yintang Yang and Ruixue Ding. Accurate Formulas for the Capacitance of Taperes-Through Silicon Vias in 3D ICs. IEEE Microwave and Wireless Components Letters, 2014, Vol.24, No.5, pp.294-296

MWCL-2)Libo Qian*, Zhangming Zhu* and Yinshui Xia. Study on Transmission Characteristics of Carbon Nanotube Through Silicon Via Interconnect. IEEE Microwave and Wireless Components Letters. 2014, vol.24, no.12. , pp.830-832

MWCL-3) Xiaoxian Liu, Zhangming Zhu*, Yintang Yang and Ruixue Ding. Parasitic Inductance of Non-uniform Through-Silicon Vias (TSVs) for Millimeter Application, IEEE Microwave and Wireless Components Letters, 2015, Vol.25, no.7, pp.424-426

MWCL-4)Zhangming Zhu*, Liang Liang, and Yintang Yang. A Startup Robust Feedback Class-C VCO with Constant Amplitude Control in 0.18μm CMOS. IEEE Microwave and Wireless Components Letters, 2015, Vol.25, no.8, pp.541-543

MWCL-5)Xiaoxian Liu, Zhangming Zhu*, Yintang Yang and Ruixue Ding. A Model of Air-Gap Through-Silicon Vias (TSVs) for Millimeter Application, IEEE Microwave and Wireless Components Letters, 2015, Vol.25, no.8,pp.493-495

MWCL-6) Xiaoxian Liu, Zhangming Zhu*, Yintang Yang and Ruixue Ding. Low-Loss Air-Cavity Through-Silicon Vias (TSVs) for High Speed Three-Dimensional Integrated Circuits (3-D ICs), IEEE Microwave and Wireless Components Letters, 2016, Vol.26, no.2,  pp.89-91

MWCL-7) Xiangkun Yin,Zhangming Zhu*, Yintang Yang. Ruixue Ding. Effectiveness of p+ Layer in Mitigating Substrate Noise Induced by Through-Silicon Via for Microwave Applications. IEEE Microwave and Wireless Components Letters, 2016, Vol.26, no9, pp.687-689

MWCL-8) Xiaoxian Liu, Zhangming Zhu*, Yintang Yang, Ruixue Ding, Yuejin Li. Electrical Modeling and Analysis of Differential Dielectric-Cavity Through-Silicon Via Array. IEEE Microwave and Wireless Components Letters, 2017, Vol.27, no.7, pp. 618-620

MWCL-9) Chenbing Qu, Ruixue Ding, Zhangming Zhu*. High-Frequency Electrical Modeling and Characterization of Differential TSVs for 3-D Integration Applications.IEEE Microwave and Wireless Components Letters, 2017, Vol.27, no.8, pp.721-723

MWCL-10) Sheng Huang, Shubin Liu, Zhangming Zhu*.  A High Resolution 2-GHz Fractional-N PLL With Crystal Oscillator PVT-Insensitive Feedback. IEEE Microwave and Wireless Components Letters, 2018, Vol.28, no.3, pp.227-229

MWCL-11)Jianqin Deng, Qijun Lu, Dinghong Jia, Yingtang Yang, Zhangming Zhu*. Wideband Fourth-Harmonic Mixer Operated at 325-500GHz. IEEE Microwave and Wireless Components Letters, 2018, Vol.28, no.3, pp.242-244

MWCL-12) Chenbing Qu, Yang Liu, Xiaoxian Liu, Zhangming Zhu*. Inductance Modeling of Interconnections in 3-D Stacked-Chip Packaging. IEEE Microwave and Wireless Components Letters, 2018, Vol.28, no.4, pp.281-283

MWCL-13) Sheng Huang, Shubin Liu, Maliang Liu, Jin Hu, Zhangming Zhu*. Low-noise fractional-N PLL with a high-precision phase control in the phase synchronization of multi-chips. IEEE Microwave and Wireless Components Letters, 2018, Vol.28, no.6, online

 

IEEE Trans. on Circuits and Systems II: Express Briefs ( IF=1.66

TCAS-II-1) Haoyu Zhuang, Zhangming Zhu* and Yintang Yang. A 19 nW, 0.7 V CMOS Voltage Reference with no Amplifiers and no Clock Circuits. IEEE Trans. on Circuits and Systems II: Express Briefs, 2014, Vol.61, no.11, pp.830-834

TCAS-II-2) Yutao wang, Zhangming Zhu*, Jiaojiao Yao, Yintang Yang. A 0.45 V, 14.6 nW CMOS Sub-threshold Voltage Reference With no Resistors and no BJTs. IEEE Trans. on Circuits and Systems II: Express Briefs, 2015, Vol.62, no.7, pp.621-625

TCAS-II-3)Zhangming Zhu*, Wenbin Bai. A 0.5V 1.3μW Analog Front-End CMOS Circuit. IEEE Trans. on Circuits and Systems II: Express Briefs, 2016, Vol.63, no. 6, pp. 253-257

TCAS-II-4) Rui Ma, Maliang Liu, Hao Zheng,Zhangming Zhu*. A 77-dB Dynamic Range Low-Power Variable-Gain Transimpedance Amplifier for Linear LADAR. IEEE Trans. on Circuits and Systems II: Express Briefs, 2018, vol.65, no.2, pp.171-175

TCAS-II-5) Dengquan Li, Zhangming Zhu*, Ruixue Ding and Yintang Yang.  1.4-mW 10-bit 150-MS/s SAR ADC With Nonbinary Split Capacitive DAC in 65 nm CMOS. IEEE Trans. on Circuits and Systems II: Express Briefs,  2018 , doi: 10.1109/TCSII.2017.2756036

TCAS-II-6) Dengquan Li, Zhangming Zhu*, Ruixue Ding, Maliang Liu, Yintang Yang, Nan Sun. A 10-bit 600-MS/s Time-Interleaved SAR ADC With Interpolation-Based Timing Skew Calibration.IEEE Trans. on Circuits and Systems II: Express Briefs, 2018, doi: 10.1109/TCSII.2018.2828649

TCAS-II-7) Yi Xie, Yuhua Liang, Maliang Liu, Shubin Liu,Zhangming Zhu*.  A 10-Bit 5 MS/s VCO-SAR ADC in 0.18-µm CMOS.  IEEE Trans. on Circuits and Systems II: Express Briefs, 2018, doi: 10.1109/TCSII.2018.2833866

 

IEEE Trans.on Very Large Scale Integrated Circuits (VLSI) Systems( IF=1.698)

TVLSI-1) Maliang Liu, Zhangming Zhu*, Yintang Yang. A High-SFDR 14-bit 500MS/s Current-Steering D/A Converter in 0.18μm CMOS. IEEE Trans.on Very Large Scale Integrated Circuits (VLSI) Systems,2015, vol.23, no.12, pp.3148-3152

TVLSI-2) Yongyuan Li, Zhangming Zhu*. A 30W 90%-Efficiency Dual-Mode Controlled DC-DC Controller with Power over Ethernet (PoE) Interface for Power Device. IEEE Trans. on Very Large Scale Integration ( VLSI) Systems. 2017, vol.25, no.6, pp.1943-1953

 

IEEE Trans. on NanotechnologyIF=2.485

TNANO-1) Qijun Lu, Zhangming Zhu*. Yintang Yang, Ruixue Ding, and Yuejin Li. Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias. IEEE Trans. on Nanotechnology, 2017,vol.16, no.4, pp.695-702

 

IEEE Trans. on Electromagnetic CompatibilityIF=1.658

TEMC-1) Chenbing Qu, Ruixue Ding, Xiaoxian Liu,Zhangming Zhu*.  Modeling and Optimization of Multi-ground TSVs for Signals Shield in 3D ICs. IEEE Trans. on Electromagnetic Compatibility. 2017, vol.59, no.2, pp.461-467

TEMC-2)Qijun Lu, Zhangming Zhu*,Yang Liu,Xiaoxian Liu,Xiangkun  Yin. Wideband Electromagnetic Modeling of Coaxial-Annular Through-Silicon Vias.IEEE Trans. on Electromagnetic Compatibility. 2018, vol.60, no.6, pp. online

 

IEEE Trans. on Components, Packaging and Manufacturing Technology (IF=1.581 )

1)Xiangkun Yin,Zhangming Zhu*, Yintang Yang. Metal Proportion Optimization of Annular Through-Silicon Via Considering Temperature and Keep-Out Zone.IEEE Trans. on Components, Packaging and Manufacturing Technology. 2015,vol.5, no.8, pp.1093-1099

2) Qijun Lu, Zhangming Zhu*, Yintang Yang,Ruixue Ding, and Yuejin Li. High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits ConsideringEddy-Current and Proximity Effects.IEEE Trans. on Components, Packaging and Manufacturing Technology. 2017,  vol.7, no.12, pp.2036-2044

3) Chenguang Liao, Zhangming Zhu*, Qijun Lu, Xiaoxian Liu, and Yintang Yang. Wideband Electromagnetic Model and Analysis of Shielded-Pair Through-Silicon Vias.IEEE Trans. on Components, Packaging and Manufacturing Technology. 2018, vol.8, no.3, pp.473-481

 

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